Heterogeneous Integration Technologies (HIT)

Research output

Research output per year 2001 2016 2017 2018 2022 2023 2024

• 74 Article
• 40 Conference Paper
• 11 Paper
• 5 Chapter
• 13 More
  • 5 Poster
  • 3 Abstract
  • 2 Conference article
  • 1 Review article
  • 1 Other contribution
  • 1 Patent

Research output per year

Research output per year

Search results

• 2024

  Future Thread: Printing Electronics on Fibers

  Jose, M., Alexandre, E. B., Neumaier, L., Rauter, L., Vijjapu, M. T., Muehleisen, W., Malik, M. H., Zikulnig, J. & Kosel, J., 4 Feb 2024, In: ACS Applied Materials & Interfaces.

  Research output: Contribution to journal › Article › peer-review

  • Printing 100%
  • Electronic equipment 87%
  • Fibers 70%
  • Smart textiles 49%
  • Coating techniques 47%
• 2023

  3D Integration via D2D Bump-Less Cu Bonding with Protruded and Recessed Topographies

  Roshanghias, A., Kaczynski, J., Rodrigues, A. D., Karami, R., Pires, M., Burggraf, J. & Schmidt, A., 2 Aug 2023, In: ECS Journal of Solid State Science and Technology. 15 p., JSS-103386.R2.

  Research output: Contribution to journal › Article › peer-review

  Open Access

  • Topography 100%
  • Polishing 51%
  • Electrical Property 37%
  • Chemical mechanical polishing 28%
  • Strength 28%

• Assessment of AF4 Parylene Cohesion/Adhesion on Si and SiO2 Substrates by Means of Pull-Off Energy

  Sinani, T., Solonenko, D. & Miskovic, G., 19 Jan 2023, In: Coatings.

  Research output: Contribution to journal › Article › peer-review

  Open Access

  File

• Efficient Xe Filling of MEMS Vapor Cells Empowered by Customized Triple Stack Wafer Bond Processing

  Roshanghias, A., Kaczynski, J., Rodrigues, A., Hübner, M., Zauner, M., Grosso, G., Andrianov, N., Khan, M., Grömer, T., Fuchs, T. & Binder, A., 29 Sept 2023, In: ECS Transactions.

  Research output: Contribution to journal › Article › peer-review

  • gyroscopes 100%
  • microelectromechanical systems 87%
  • vapors 68%
  • wafers 68%
  • nuclear magnetic resonance 54%

• Experimental characterization of piezoelectric and elastic operational field-dependent non-linearities of multilayer benders for resonant driving of bone-conduction hearing aids via a dual-actuators side-by-side device

  Benjeddou, A., Enriquez, D. J., Schicker, J., Binder, A. & Sinani, T., 12 Jan 2023, (Accepted/In press) In: Mechanics of Advanced Materials and Structures.

  Research output: Contribution to journal › Article › peer-review

  • Bender Reaction 100%
  • Hearing aids 75%
  • Piezoelectric 74%
  • Actuator 73%
  • Bone 71%

• Fabrication and Characterization of Printed Phototransistors Based on Monochalcogenide Inks

  Odaci, C., Mühleisen, W., Aydemir, U. & Roshanghias, A., 4 Apr 2023, In: ACS Applied Electronic Materials.

  Research output: Contribution to journal › Article › peer-review

  • Phototransistors 100%
  • Gallium 89%
  • Ink 67%
  • Characterization (materials science) 54%
  • Fabrication 46%

• Flip Chip Bonding on Stretchable Printed Substrates; The Effects of Stretchable Material and Chip Encapsulation

  Malik, M. H., Kaczynski, J., Zangl, H. & Roshanghias, A., 24 Jan 2023, In: Flexible and Printed Electronics. 8, 1

  Research output: Contribution to journal › Article › peer-review

  Open Access

  File

  • chips 100%
  • electronics 49%
  • robotics 37%
  • silicon 33%
  • adhesives 30%

• In-Line Monitoring of a Curing Process With a Multisensor Concept

  Mühleisen, W., Yan, D., Wolf, T., Grinschgl, M., Kasinikota, V. P. & Lang, M., 1 Sept 2023, In: IEEE Sensors Letters. 7, 9, p. 1-4 4 p., 10225671.

  Research output: Contribution to journal › Article › peer-review

  • curing 100%
  • Curing 89%
  • sensors 57%
  • Monitoring 53%
  • Sensors 48%

• Sustainable Multifunctional Biface Sensor Tag

  Rauter, L., Zikulnig, J., Moldaschl, T., Lenzhofer, M., Khan, S. M., Neumaier, L., Lengger, S., Beduk, T., Malik, M. H., Jose, M., Zangl, H. & Kosel, J., 3 Jan 2023, (E-pub ahead of print) In: Advanced Sensor Research.

  Research output: Contribution to journal › Article › peer-review

  Open Access
• 2022

  Additive manufacturing for nano-feature applications: Electrohydrodynamic printing as a next-generation enabling technology

  Miskovic, G. & Kaufhold, R., 23 Nov 2022, In: IEEE Open Journal of Nanotechnology. 2022, volume 3, p. 191-198

  Research output: Contribution to journal › Article › peer-review

  Open Access

  • Electrohydrodynamics 100%
  • 3D printers 68%
  • Printing 66%
  • Additive 46%
  • Fabrication 34%

• Die-Level Thinning for Flip-Chip Integration on Flexible Substrates

  Malik, M. H., Tsiamis, A., Zangl, H., Binder, A., Mitra, S. & Roshanghias, A., 8 Mar 2022, In: Electronics.

  Research output: Contribution to journal › Article › peer-review

• Direct flip-chip bonding of bare dies to polypropylene-coated paper substrates without adhesives or solders

  Rodrigues, A. D., Weissbach, T., Malik, M. H., Schmidt, W., Gumbiowski, R., Hübler, A., Binder, A. & Roshanghias, A., 26 Jul 2022, In: Journal of Materials Science: Materials in Electronics.

  Research output: Contribution to journal › Article › peer-review

  Open Access

  • Solder 100%
  • solders 90%
  • polypropylene 82%
  • Polypropylenes 82%
  • adhesives 79%

• Evaluating Cu Printed Interconnects “Sinterconnects” versus Wire Bonds for Switching Converters

  Hasan, M. N., Polom, T., Holzmann, D., Malagó, P., Binder, A. & Roshanghias, A., 25 Apr 2022, In: Electronics.

  Research output: Contribution to journal › Article › peer-review

• Glass Frit Jetting for Advanced Wafer-Level Hermetic Packaging

  Roshanghias, A., Bardong, J. & Binder, A., 11 Apr 2022, In: Materials.

  Research output: Contribution to journal › Article › peer-review

  Open Access

  File
• 2021

  ACF bonding technology for paper- and PET-based disposable flexible hybrid electronics

  Yoon, D-J., Malik, M-H., Yan, P., Paik, K-W. & Roshanghias, A., 2 Jan 2021, In: Journal of Materials Science: Materials in Electronics. 32

  Research output: Contribution to journal › Article › peer-review

  • polyethylene terephthalate 100%
  • electronics 46%
  • cycles 44%
  • chips 35%
  • kits 31%

• Comparison of the parasitic Impedances from the Drain-Source Path of Power Transistor Packages at up to 2 GHz

  Moldaschl, T., Woetzel, S., Latella, R., Galvano, I. & Binder, A., 2021, In: Engineering Reports.

  Research output: Contribution to journal › Article › peer-review

  • transistors 100%
  • impedance 95%
  • method of moments 49%
  • gallium nitrides 48%
  • inductance 44%

• Flip Chip integration of ultra-thinned dies in low-cost flexible printed electronics; the effects of die thickness, encapsulation and conductive adhesives

  Malik, M. H., Grosso, G., Zangl, H., Binder, A. & Roshanghias, A., 1 Aug 2021, In: Microelectronics Reliability. 123, p. 114204

  Research output: Contribution to journal › Article › peer-review

  Open Access

  • Encapsulation 100%
  • Foil 88%
  • adhesives 86%
  • Adhesives 79%
  • Electronic equipment 74%

• Optimization of Resonant PZT MEMS Mirrors by Inverse Design and Electrode Segmentation

  Piot, A., Pribosek, J., Maufay, J., Schicker, J., Tortschanoff, A., Matloub, R., Muralt, P. & Moridi, M., 1 Apr 2021, In: Journal of Microelectromechanical Systems. 30, 2, p. 216-223

  Research output: Contribution to journal › Article › peer-review

• Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging

  Roshanghias, A., Malago, P., Kaczynski, J., Polom, T., Bardong, J., Holzmann, D., Malik, M-H., Ortner, M., Hirschl, C. & Binder, A., 13 Apr 2021, In: Energies. 14, 8

  Research output: Contribution to journal › Article › peer-review

  Open Access

  • Interconnect 100%
  • Packaging 95%
  • Copper 94%
  • Interconnection 50%
  • Module 45%
• 2020

  Computationally efficient model for viscous damping in perforated MEMS structures

  Kaczynski, J., Ranacher, C. & Fleury, C., 2020, In: Sensors and Actuators A: Physical. 2020, 112201

  Research output: Contribution to journal › Article › peer-review

• Evaluation of Standard Electrical Bonding Strategies for the Hybrid Integration of Inkjet-Printed Electronics

  Rauter, L., Zikulnig, J., Sinani, T., Zangl, H. & Faller, L-M., 30 Aug 2020, In: Electronic Materials.

  Research output: Contribution to journal › Article › peer-review

• Evaluation of the Sheet Resistance of Inkjet-Printed Ag-Layers on Flexible, Uncoated Paper Substrates Using Van-der-Pauw’s Method

  Zikulnig, J., Roshanghias, A., Rauter, L. & Hirschl, C., 23 Apr 2020, In: Sensors.

  Research output: Contribution to journal › Article › peer-review

• Miniaturized On-Chip NFC Antenna versus Screen-Printed Antenna for the Flexible Disposable Sensor Strips

  Kordzadeh, A., Holzmann, D., Binder, A., Moldaschl, T., Sturm, J. & Roshanghias, A., 28 Oct 2020, In: IoT. 1, 2, p. 309-319 11 p.

  Research output: Contribution to journal › Article › peer-review

  Open Access

  • Near field communication 100%
  • Microstrip antennas 68%
  • Antennas 45%
  • Sensors 36%
  • Substrates 22%

• On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers

  Roshanghias, A., Dreissigacker, M., Scherf, C., Bretthauer, C., Rauter, L., Zikulnig, J., Braun, T., Becker, K-F., Rzepka, S. & Schneider-Ramelow, M., 31 May 2020, In: Micromachines.

  Research output: Contribution to journal › Article › peer-review

• Thermosonic direct Cu pillar bonding for 3D die stacking

  Roshanghias, A., Rodrigues, A., Schwarz, S. & Steiger-Thirsfeld, A., Jun 2020, In: SN Applied Sciences.

  Research output: Contribution to journal › Article › peer-review

• Thermosonic fine-pitch flipchip bonding of silicon chips on screen printed paper and PET substrates

  Roshanghias, A., Rodrigues, A. D. & Holzmann, D., May 2020, In: Microelectronic Engineering.

  Research output: Contribution to journal › Article › peer-review
• 2019

  Hybrid Printing for the Fabrication of Smart Sensors

  Faller, L-M., Zikulnig, J., Krivec, M., Roshanghias, A., Abram, A. & Zangl, H., Jan 2019, In: Journal of Visualized Experiments.

  Research output: Contribution to journal › Article › peer-review

• Inkjet printed adhesives for advanced M(O)EMS packaging

  Roshanghias, A., Ma, Y., Gaumont, E. & Neumaier, L., 22 Nov 2019, In: Journal of Materials Science: Materials in Electronics.

  Research output: Contribution to journal › Article › peer-review

• Inkjet printing and characterisation of a resistive temperature sensor on paper substrate

  Zikulnig, J., Hirschl, C., Rauter, L., Krivec, M., Lammer, H., Riemelmoser, F. & Roshanghias, A., 28 Mar 2019, In: Flexible and Printed Electronics.

  Research output: Contribution to journal › Article › peer-review

• RFID-based Wireless Sensor Network for Semiconductor Manufacturing Equipment to enable Predictive Maintenance

  Moldaschl, T., Travnik, A., Frank, A., Bardong, J., Cramer, H., Kastberger, H., Weitlaner, M., Jerne, M., Nazarov, A. & Hirschl, C., Apr 2019, In: Proceedings of the 13th international conference on Smart Systems Integration.

  Research output: Contribution to journal › Article

  • Predictive maintenance 100%
  • Radio frequency identification (RFID) 73%
  • Semiconductor materials 69%
  • Wireless sensor networks 61%
  • Sensors 40%

• Wireless readout of multiple SAW temperature sensors

  Bruckner, G. & Bardong, J., 2 Jul 2019, In: Sensors. 19, 14

  Research output: Contribution to journal › Article › peer-review

  • Surface Acoustic Wave 100%
  • temperature sensors 79%
  • Surface waves 79%
  • Temperature sensors 76%
  • readout 64%
• 2018

  A comparative study on direct Cu–Cu bonding methodologies for copper pillar bumped flip-chips

  Ma, Y., Roshanghias, A. & Binder, A., 28 Mar 2018, In: Journal of Materials Science: Materials in Electronics. 29, 11, p. 9347-9353 7 p.

  Research output: Contribution to journal › Article › peer-review

  • Copper 100%
  • methodology 99%
  • chips 97%
  • copper 87%
  • Pressure 71%

• A novel interferometric characterization technique for 3D analyses at high pressures and temperatures

  Roshanghias, A., Bardong, J., Pulko, J. & Binder, A., 28 Mar 2018, In: Journal of Physics D: Applied Physics. 51, 16

  Research output: Contribution to journal › Article › peer-review

  • characterization 100%
  • microelectromechanical systems 87%
  • topography 83%
  • glass 78%
  • interferometers 72%

• MWCNT–Epoxy Nanocomposite Sensors for Structural Health Monitoring

  Roshanghias, A., Aug 2018, In: Electronics.

  Research output: Contribution to journal › Article › peer-review

• Nano-porous aluminum oxide membrane as filtration interface for optical gas sensor packaging

  Ma, Y., Kaczynski, J., Ranacher, C., Roshanghias, A., Zauner, M. & Abasahl, B., 2018, In: Microelectronic Engineering.

  Research output: Contribution to journal › Article › peer-review

• Sinter bonding of inkjet-printed Ag die-attach as an alternative to Ag paste

  Roshanghias, A., 8 Jul 2018, In: Journal of Materials Science: Materials in Electronics.

  Research output: Contribution to journal › Article › peer-review

• The Realization of Redistribution Layers for FOWLP by Inkjet Printing

  Roshanghias, A., Ma, Y., Dreissigacker, M., Braun, T., Bretthauer, C., Becker, K-F. & Schneider-Ramelow, M., 13 Dec 2018, In: Proceedings.

  Research output: Contribution to journal › Article › peer-review
• 2017

  3DInkPack—Inkjet Printing of Discrete Sensor Packages for Advanced Rapid Prototyping

  Krivec, M., Roshanghias, A. & Binder, A., 29 Aug 2017, In: Proceedings. 1, 4, p. 609

  Research output: Contribution to journal › Article › peer-review

  Open Access

• Exploiting the combination of 3D polymer printing and inkjet Ag-nanoparticle printing for advanced packaging

  Krivec, M., Roshanghias, A., Abram, A. & Binder, A., 25 May 2017, In: Microelectronic Engineering. 176, p. 1-5 5 p.

  Research output: Contribution to journal › Article › peer-review

  • Silver nanoparticles 100%
  • Transponders 83%
  • Surface waves 76%
  • Printing 66%
  • Packaging 62%

• High temperature MEMS packages: die-attach solutions for LiNbO3 under low bonding pressures

  Roshanghias, A., Bruckner, G. & Binder, A., 2017, In: Journal of Materials Science: Materials in Electronics. 12, p. 8784-8792 9 p.

  Research output: Contribution to journal › Article › peer-review

  • microelectromechanical systems 100%
  • silver 67%
  • assemblies 42%
  • adhesives 40%
  • failure analysis 27%

• Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8Ag–0.7Cu solders by adding Co nanoparticles

  Yakymovych, A., Plevachuk, Y., Švec, P., Janičkovič, D., Šebo, P., Beronská, N., Nosko, M., Orovcik, L., Roshanghias, A. & Ipser, H., 2017, In: Journal of Materials Science: Materials in Electronics.

  Research output: Contribution to journal › Article › peer-review

• Numerical investigation of particle separation in a centrifugal air separator

  Kaczynski, J. & Kraft, M., 2017, In: Transaction of Institute of Fluid-Flow Machinery. 2017, 135, p. 57-71

  Research output: Contribution to journal › Article › peer-review

• Self-propagating reactive Al/Ni nanocomposites for bonding applications

  Kremer, M. P., Roshanghias, A. & Tortschanoff, A., 8 Feb 2017, In: Micro and Nano Systems Letters.

  Research output: Contribution to journal › Article › peer-review

• Sintering strategies for inkjet printed metallic traces in 3D printed electronics

  Roshanghias, A., Krivec, M. & Baumgart, M., 25 Dec 2017, In: Flexible and Printed Electronics.

  Research output: Contribution to journal › Article › peer-review

• Stress-warping relation in thin film coated wafers

  Schicker, J., Khan, W. A., Arnold, T. & Hirschl, C., 2017, In: Modelling and Simulation in Materials Science and Engineering.

  Research output: Contribution to journal › Article › peer-review
• 2016

  An attempt to synthesize Sn-Zn-Cu alloy nanoparticles

  Roshanghias, A., Bernardi, J. & Ipser, H., 2016, In: Materials Letters.

  Research output: Contribution to journal › Article › peer-review

• Enthalpy effect of adding cobalt to liquid Sn-3.8Ag-0.7Cu lead-free solder alloy: Difference between bulk and nanosized cobalt

  Yakymovych, A., Kaptay, G., Roshanghias, A., Flandorfer, H. & Ipser, H., 2016, In: Journal of Physical Chemistry C.

  Research output: Contribution to journal › Article › peer-review

• High-accuracy Nanoparticle Sensor for Combustion Engine Exhaust Gases

  Kraft, M., Kaczynski, J., Reinisch, T., Unger, M. & Bergmann, A., 1 Dec 2016, In: Procedia Engineering. 168, p. 35-38

  Research output: Contribution to journal › Article › peer-review

  Open Access

• Investigation of low-temperature cofired ceramics packages for high-temperature SAW sensors

  Bardong, J., Binder, A., Toskov, S., Miskovic, G. & Radosavljevic, G., 17 Mar 2016, In: Journal of Sensors and Sensor Systems. 5, 1, p. 85-93 9 p.

  Research output: Contribution to journal › Article › peer-review

  Open Access

  • Surface waves 100%
  • Acoustic waves 70%
  • ceramics 60%
  • sensors 54%
  • acoustics 51%

• Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles

  Yakymovych, A., Plevachuk, Y., Švec, P., Švec, P., Janičkovič, D., Šebo, P., Beronská, N., Roshanghias, A. & Ipser, H., 2016, In: Journal of Electronic Materials.

  Research output: Contribution to journal › Article › peer-review