TY - JOUR
T1 - Efficient Xe Filling of MEMS Vapor Cells Empowered by Customized Triple Stack Wafer Bond Processing
AU - Roshanghias, Ali
AU - Kaczynski, Jaroslaw
AU - Rodrigues, Augusto
AU - Hübner, Martina
AU - Zauner, Markus
AU - Grosso, Giovanna
AU - Andrianov, Nikolai
AU - Khan, Muhammad
AU - Grömer, Thomas
AU - Fuchs, Tino
AU - Binder, Alfred
PY - 2023/9/29
Y1 - 2023/9/29
N2 - Nuclear-magnetic-resonance (NMR) gyroscopes based on MEMS vapor cell technology are currently being investigated worldwide and show superior advantages over current MEMS gyroscopes. However, there are still challenges in the upscaling and further deployment of NMR gyroscopes, due to the extremely high cost of the required gases (i.e., 129Xe, 131Xe), size, and high power consumption. To tackle these bottlenecks, in this study, a miniaturized, chip-scale, and low-cost NMR gyroscope has been conceptualized and fabricated. Here, a cost-effective and scalable filling of MEMS vapor cells with Xe gas was developed via an innovative microfabrication and wafer stacking process flow. By utilizing ultra-thin glass wafers, Taiko-processed silicon wafers, and an external gas flow system integrated into the wafer bonder, a sequential anodic bonding technique is executed to create a hermetically sealed Xe gas-filled chamber at minimal Xe consumption during the filling process.
AB - Nuclear-magnetic-resonance (NMR) gyroscopes based on MEMS vapor cell technology are currently being investigated worldwide and show superior advantages over current MEMS gyroscopes. However, there are still challenges in the upscaling and further deployment of NMR gyroscopes, due to the extremely high cost of the required gases (i.e., 129Xe, 131Xe), size, and high power consumption. To tackle these bottlenecks, in this study, a miniaturized, chip-scale, and low-cost NMR gyroscope has been conceptualized and fabricated. Here, a cost-effective and scalable filling of MEMS vapor cells with Xe gas was developed via an innovative microfabrication and wafer stacking process flow. By utilizing ultra-thin glass wafers, Taiko-processed silicon wafers, and an external gas flow system integrated into the wafer bonder, a sequential anodic bonding technique is executed to create a hermetically sealed Xe gas-filled chamber at minimal Xe consumption during the filling process.
UR - https://doi.org/10.1149/11203.0221ecst
U2 - 10.1149/11203.0221ecst
DO - 10.1149/11203.0221ecst
M3 - Article
JO - ECS Transactions
JF - ECS Transactions
ER -