Thermosonic fine-pitch flipchip bonding of silicon chips on screen printed paper and PET substrates

Research output: Contribution to journal › Article › peer-review

Original language	English
Journal	Microelectronic Engineering
DOIs	https://doi.org/10.1016/j.mee.2020.111330
Publication status	Published - May 2020

Access to Document

TY - JOUR

T1 - Thermosonic fine-pitch flipchip bonding of silicon chips on screen printed paper and PET substrates

AU - Roshanghias, Ali

AU - Rodrigues, Augusto Daniel

AU - Holzmann, Dominik

PY - 2020/5

Y1 - 2020/5

UR - https://doi.org/10.1016/j.mee.2020.111330

U2 - 10.1016/j.mee.2020.111330

DO - 10.1016/j.mee.2020.111330

M3 - Article

JO - Microelectronic Engineering

JF - Microelectronic Engineering

ER -