Heterogeneous Integration Technologies (HIT)

Research output

Research output per year 2001 2016 2017 2018 2022 2023 2024

• 74 Article
• 40 Conference Paper
• 11 Paper
• 5 Chapter
• 13 More
  • 5 Poster
  • 3 Abstract
  • 2 Conference article
  • 1 Review article
  • 1 Other contribution
  • 1 Patent

Research output per year

Research output per year

Search results

• 2024

  Eco-Conscious Approach to Wireless Gas Monitoring: Development of a Hybrid NFC Sensor Tag

  Zikulnig, J., Rauter, L., Malik, M. H., Neumaier, L., Carrara, S. & Kosel, J., 6 Mar 2024.

  Research output: Contribution to conference (No Proceedings) › Poster › peer-review

  File

  • Near field communication 100%
  • Gases 40%
  • Monitoring 39%
  • Sensors 36%
  • 3D printers 35%

• Future Thread: Printing Electronics on Fibers

  Jose, M., Alexandre, E. B., Neumaier, L., Rauter, L., Vijjapu, M. T., Muehleisen, W., Malik, M. H., Zikulnig, J. & Kosel, J., 4 Feb 2024, In: ACS Applied Materials & Interfaces.

  Research output: Contribution to journal › Article › peer-review

  • Printing 100%
  • Electronic equipment 87%
  • Fibers 70%
  • Smart textiles 49%
  • Coating techniques 47%

• Magnetic Field Sensors for Non-Invasive Current Monitoring in Wire-Bond-Less Power Modules

  Malagò, P., Lumetti, S., Holzmann, D., Ortner, M. & Roshanghias, A., 27 Mar 2024, MDPI - Proceedings 2024.

  Research output: Conference proceeding/Chapter in Book/Report/ › Conference Paper › peer-review
• 2023

  3D Integration via D2D Bump-Less Cu Bonding with Protruded and Recessed Topographies

  Roshanghias, A., Kaczynski, J., Rodrigues, A. D., Karami, R., Pires, M., Burggraf, J. & Schmidt, A., 2 Aug 2023, In: ECS Journal of Solid State Science and Technology. 15 p., JSS-103386.R2.

  Research output: Contribution to journal › Article › peer-review

  Open Access

  • Topography 100%
  • Polishing 51%
  • Electrical Property 37%
  • Chemical mechanical polishing 28%
  • Strength 28%

• Assessment of AF4 Parylene Cohesion/Adhesion on Si and SiO2 Substrates by Means of Pull-Off Energy

  Sinani, T., Solonenko, D. & Miskovic, G., 19 Jan 2023, In: Coatings.

  Research output: Contribution to journal › Article › peer-review

  Open Access

  File

• Calculation of the resistance of silver-based backside metallization stack for die-attach packaging applications

  Malago, P., Miskovic, G. & Bellaredj, M. L. F., 15 Mar 2023.

  Research output: Contribution to conference (No Proceedings) › Abstract › peer-review

• Calculation of the resistance of silver-based backside metallization stack for die-attach packaging applications

  Malago, P., Miskovic, G. & Bellaredj, M. L. F., 6 Jul 2023, In: IEEE Xplore.

  Research output: Contribution to journal › Conference article › peer-review

• Design and Multiphysics Simulation of a PCB-Embedded-Package Enclosing a Gallium Nitride System on Chip Grown on a Novel Substrate

  Pradhan, A., Moldaschl, T., Hasan, M. N., Schicker, J., Binder, A. & De Doncker, R. W., 4 Jul 2023, PCIM Europe 2023; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. VDE Verlag GmbH, p. 2075-2079 5 p.

  Research output: Conference proceeding/Chapter in Book/Report/ › Conference Paper › peer-review

  • gallium nitrides 100%
  • systems-on-a-chip 63%
  • thermal simulation 59%
  • power loss 50%
  • thermal resistance 46%

• Efficient Xe Filling of MEMS Vapor Cells Empowered by Customized Triple Stack Wafer Bond Processing

  Roshanghias, A., Kaczynski, J., Rodrigues, A., Hübner, M., Zauner, M., Grosso, G., Andrianov, N., Khan, M., Grömer, T., Fuchs, T. & Binder, A., 29 Sept 2023, In: ECS Transactions.

  Research output: Contribution to journal › Article › peer-review

  • gyroscopes 100%
  • microelectromechanical systems 87%
  • vapors 68%
  • wafers 68%
  • nuclear magnetic resonance 54%

• Electrohydrodynamic printing of sub-10-micrometer nanoparticles based structures

  Kaufhold, R. & Khan, S. M., 2023, Chip2Sys Symposium

  Research output: Other contribution

• Experimental characterization of piezoelectric and elastic operational field-dependent non-linearities of multilayer benders for resonant driving of bone-conduction hearing aids via a dual-actuators side-by-side device

  Benjeddou, A., Enriquez, D. J., Schicker, J., Binder, A. & Sinani, T., 12 Jan 2023, (Accepted/In press) In: Mechanics of Advanced Materials and Structures.

  Research output: Contribution to journal › Article › peer-review

  • Bender Reaction 100%
  • Hearing aids 75%
  • Piezoelectric 74%
  • Actuator 73%
  • Bone 71%

• Fabrication and Characterization of Printed Phototransistors Based on Monochalcogenide Inks

  Odaci, C., Mühleisen, W., Aydemir, U. & Roshanghias, A., 4 Apr 2023, In: ACS Applied Electronic Materials.

  Research output: Contribution to journal › Article › peer-review

  • Phototransistors 100%
  • Gallium 89%
  • Ink 67%
  • Characterization (materials science) 54%
  • Fabrication 46%

• Flip Chip Bonding on Stretchable Printed Substrates; The Effects of Stretchable Material and Chip Encapsulation

  Malik, M. H., Kaczynski, J., Zangl, H. & Roshanghias, A., 24 Jan 2023, In: Flexible and Printed Electronics. 8, 1

  Research output: Contribution to journal › Article › peer-review

  Open Access

  File

  • chips 100%
  • electronics 49%
  • robotics 37%
  • silicon 33%
  • adhesives 30%

• Fully Printed GaTe Based Photodetector on PET Substrate

  Odaci, C., Khan, M. S., Corzo, D., Jose, M., Roshanghias, A. & Aydemir, U., 2023, Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC), Munich, Germany, 2023. Munich, Germany

  Research output: Conference proceeding/Chapter in Book/Report/ › Conference Paper › peer-review

  • tellurides 100%
  • gallium 77%
  • photometers 67%
  • printing 49%
  • indium selenides 38%

• GaSe-Based Fiber Optic Sensor for Human Health Monitoring

  Odaci, C., Khan, M. S., Grüneberg, M., Beduk, T., Montagnese, M., Roshanghias, A. & Aydemir, U., 2023, 2023 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC). Munich, Germany

  Research output: Conference proceeding/Chapter in Book/Report/ › Conference Paper › peer-review

  • Lactate 100%
  • Chemical Species 36%
  • Cosmetic 33%
  • Refractive Index 31%
  • Charge Carrier 31%

• In-Line Monitoring of a Curing Process With a Multisensor Concept

  Mühleisen, W., Yan, D., Wolf, T., Grinschgl, M., Kasinikota, V. P. & Lang, M., 1 Sept 2023, In: IEEE Sensors Letters. 7, 9, p. 1-4 4 p., 10225671.

  Research output: Contribution to journal › Article › peer-review

  • curing 100%
  • Curing 89%
  • sensors 57%
  • Monitoring 53%
  • Sensors 48%

• In-Line Monitoring of a Curing Process with a multi-Sensor Concept

  Mühleisen, W., Yan, D., Wolf, T., Grinschgl, M., Kasinikota, V. P. & Lang, M., 30 Oct 2023.

  Research output: Contribution to conference (No Proceedings) › Poster

  • Curing 100%
  • Production control 66%
  • Monitoring 59%
  • Sensors 54%
  • Temperature 21%

• Integration and Packaging for Water Monitoring Systems

  Malik, M. H. & Roshanghias, A., 31 Aug 2023, Sensing Technologies for Real Time Monitoring of Water Quality. Hoboken, New Jersey, p. 161 184 p.

  Research output: Conference proceeding/Chapter in Book/Report/ › Chapter › peer-review

  • Monitoring 100%
  • Water 96%
  • Electronics packaging 45%
  • Integrated circuits 32%
  • Fabrication 26%

• Integration of a High Temperature Transition Metal Oxide NTC Thin Film in a Microbolometer for LWIR Detection

  Risquez, S., Redolfi, S., Fleury, C., Wulf, M., Roshanghias, A., Piot, A., Streque, J., Schmoltner, K., Dao, T. D., Puff, M. & Moridi, M., 2023, Integration of a High Temperature Transition Metal Oxide NTC Thin Film in a Microbolometer for LWIR Detection.

  Research output: Conference proceeding/Chapter in Book/Report/ › Conference Paper › peer-review

  • silicon nitrides 100%
  • metal oxides 98%
  • transition metals 85%
  • pixels 83%
  • membranes 75%

• Magnetic field sensors for non-invasive current monitoring in wire-bond-less power modules

  Malago, P., Lumetti, S., Holzmann, D., Ortner, M. & Roshanghias, A., 2023, Magnetic field sensors for non-invasive current monitoring in wire-bond-less power modules.

  Research output: Conference proceeding/Chapter in Book/Report/ › Conference Paper › peer-review

• Non-destructive Na content analysis in bonded silicon-glass microcavities using laser-induced breakdown spectroscopy

  Bereczki, T., Cselyuszka, N., 张俞骋, Guso, E., Fugger-Schafhauser, D. M., Menezes de Oliveira, B. N., Roshanghias, A. & Andrianov, N., 2023, Optical Waveguide and Laser Sensors II,.

  Research output: Conference proceeding/Chapter in Book/Report/ › Conference Paper › peer-review

  • laser-induced breakdown spectroscopy 100%
  • cathodes 49%
  • glass 47%
  • silicon 44%
  • cavities 37%

• Printed Electronics Technologies for Additive Manufacturing of Hybrid Electronic Sensor Systems

  Zikulnig, J., Chang, S., Bito, J., Rauter, L., Roshanghias, A., Carrara, S. & Kosel, J., 27 Feb 2023, In: Advanced Sensor Research. 2200073.

  Research output: Contribution to journal › Review article › peer-review

  Open Access

  File

  • 3D printers 100%
  • Electronic equipment 85%
  • Sensors 51%
  • Printing 39%
  • Scalability 32%

• Soft mask-based dry etching of parylene AF4 for advanced packaging applications

  Bellaredj, M. L. F., Andrianov, N., Kaufhold, R. & Miskovic, G., 18 Jan 2023, p. 109. 113 p.

  Research output: Contribution to conference (No Proceedings) › Paper › peer-review

  • packaging 100%
  • masks 81%
  • etching 71%
  • photoresists 50%
  • argon 24%

• Sustainable Multifunctional Biface Sensor Tag

  Rauter, L., Zikulnig, J., Moldaschl, T., Lenzhofer, M., Khan, S. M., Neumaier, L., Lengger, S., Beduk, T., Malik, M. H., Jose, M., Zangl, H. & Kosel, J., 3 Jan 2023, (E-pub ahead of print) In: Advanced Sensor Research.

  Research output: Contribution to journal › Article › peer-review

  Open Access
• 2022

  Additive manufacturing for nano-feature applications: Electrohydrodynamic printing as a next-generation enabling technology

  Miskovic, G. & Kaufhold, R., 23 Nov 2022, In: IEEE Open Journal of Nanotechnology. 2022, volume 3, p. 191-198

  Research output: Contribution to journal › Article › peer-review

  Open Access

  • Electrohydrodynamics 100%
  • 3D printers 68%
  • Printing 66%
  • Additive 46%
  • Fabrication 34%

• Adhesion evaluation of parylene AF4 to silicon and glass substrate

  Sinani, T. & Miskovic, G., 4 Jul 2022, 2022 45th International Spring Seminar on Electronics Technology .

  Research output: Conference proceeding/Chapter in Book/Report/ › Conference Paper › peer-review

  • adhesion 100%
  • wafers 88%
  • evaluation 74%
  • glass 68%
  • silicon 63%

• Detachable Ultrasonic Data Communication Through the Metal plate with NFC Technology

  Abbaszadeh, J., Pashchenko, V., Gebhart, M., Travnik, A., Bardong, J. & Moridi, M., 10 Oct 2022, 2022 IEEE International Ultrasonics Symposium (IUS).

  Research output: Conference proceeding/Chapter in Book/Report/ › Conference Paper › peer-review

  • Near field communication 100%
  • Plate metal 93%
  • Ultrasonics 60%
  • Metals 45%
  • Lead zirconate titanate 43%

• Die-Level Thinning for Flip-Chip Integration on Flexible Substrates

  Malik, M. H., Tsiamis, A., Zangl, H., Binder, A., Mitra, S. & Roshanghias, A., 8 Mar 2022, In: Electronics.

  Research output: Contribution to journal › Article › peer-review

• Direct flip-chip bonding of bare dies to polypropylene-coated paper substrates without adhesives or solders

  Rodrigues, A. D., Weissbach, T., Malik, M. H., Schmidt, W., Gumbiowski, R., Hübler, A., Binder, A. & Roshanghias, A., 26 Jul 2022, In: Journal of Materials Science: Materials in Electronics.

  Research output: Contribution to journal › Article › peer-review

  Open Access

  • Solder 100%
  • solders 90%
  • polypropylene 82%
  • Polypropylenes 82%
  • adhesives 79%

• Evaluating Cu Printed Interconnects “Sinterconnects” versus Wire Bonds for Switching Converters

  Hasan, M. N., Polom, T., Holzmann, D., Malagó, P., Binder, A. & Roshanghias, A., 25 Apr 2022, In: Electronics.

  Research output: Contribution to journal › Article › peer-review

• Glass Frit Jetting for Advanced Wafer-Level Hermetic Packaging

  Roshanghias, A., Bardong, J. & Binder, A., 11 Apr 2022, In: Materials.

  Research output: Contribution to journal › Article › peer-review

  Open Access

  File

• High Performance Acoustofluidic Particle Focusing in Silicon-Based and Polymer-Based Devices Using Lateral Modes of Plate Transducers

  Fuchsluger, K., De Pastina, A., Cselyuszka, N., Andrianov, N., Roshanghias, A., Ecker, R., Mitteramskogler, K., Voglhuber-Brunnmaier, K., Moridi, M. & Jakoby, B., 20 Oct 2022.

  Research output: Contribution to conference (No Proceedings) › Abstract › peer-review

  • transducers 100%
  • polymers 71%
  • silicon 66%
  • performance 54%
  • actuation 51%

• Hybrid Integration of fine-pitch bare dies on polypropylene-coated paper substrates without using any adhesives or solders

  Rodrigues, A. D., Weissbach, T., Malik, M. H., Schmidt, W., Gumbiowski, R., C. Hübler, A., Binder, A. & Roshanghias, A., 22 Mar 2022, p. 1. 1 p.

  Research output: Contribution to conference (No Proceedings) › Poster

  • Polypropylenes 100%
  • Soldering alloys 96%
  • Adhesives 88%
  • Substrates 69%
  • Radio frequency identification (RFID) 55%

• Low-density SiOC thin films grown by low temperature plasma-enhanced chemical vapor deposition for high performance acoustic Bragg mirrors

  Pilz, J., Andrianov, N., Sinani, T., Azeem, S. M., Dao, T. D., Moridi, M. & Bruckner, G., 10 Nov 2022.

  Research output: Contribution to conference (No Proceedings) › Poster

• Spectroscopic ellipsometry study of parylene AF4

  Solonenko, D., Petschnigg, M., Dao, T. D. & Miskovic, G., 4 Jul 2022, 2022 45th International Spring Seminar on Electronics Technology (ISSE).

  Research output: Conference proceeding/Chapter in Book/Report/ › Conference Paper › peer-review

  • ellipsometry 100%
  • refractivity 47%
  • optical transition 35%
  • ultraviolet radiation 33%
  • extinction 28%

• Strong correlation of the piezoelectric response and microstructure in AlYN solid solutions

  Solonenko, D., Strube, J., Fammels, J., Röbisch, V., Howell, K., Zhao, X., Pilz, J., Risquez, S., Moridi, M. & Bruckner, G., 19 Sept 2022.

  Research output: Contribution to conference (No Proceedings) › Poster

  • solid solutions 100%
  • microstructure 71%
  • sputtering 47%
  • wurtzite 45%
  • yttrium 32%

• Through-Wall Acoustically Linked Temperature Sensor

  Pashchenko, V., Abbaszadeh, J., Travnik, A., Bardong, J. & Moridi, M., 10 Oct 2022, 2022 IEEE International Ultrasonics Symposium (IUS). p. 1-4 4 p.

  Research output: Conference proceeding/Chapter in Book/Report/ › Conference Paper › peer-review

  • temperature sensors 100%
  • temperature measurement 81%
  • transducers 72%
  • thermistors 57%
  • wall temperature 52%

• Ultra-Thin Chips (UTC) Integration on Inkjet-Printed Papers

  Malik, M. H., Rauter, L., Zangl, H., Binder, A. & Roshanghias, A., 30 Jun 2022, Ultra-Thin Chips (UTC) Integration on Inkjet-Printed Papers. p. 1-4

  Research output: Conference proceeding/Chapter in Book/Report/ › Conference Paper › peer-review

  Open Access

  • Electronic paper 100%
  • Printing 89%
  • Fabrication 22%
  • Substrates 21%
  • Networks (circuits) 17%

• Utilizing Lateral Plate Transducer Modes for High Quality Acoustofluidics in Silicon-Based Chips

  Fuchsluger, K., De Pastina, A., Nikolai, A., Roshanghias, A., Cselyuszka, N., Mitteramskogler, K., Ecker, K., Moridi, M. & Jakoby, B., 2022, Utilizing Lateral Plate Transducer Modes for High Quality Acoustofluidics in Silicon-Based Chips. p. 1 4 p.

  Research output: Conference proceeding/Chapter in Book/Report/ › Conference Paper › peer-review

  Open Access

  • transducers 100%
  • chips 97%
  • silicon 66%
  • heat generation 36%
  • holders 34%
• 2021

  ACF bonding technology for paper- and PET-based disposable flexible hybrid electronics

  Yoon, D-J., Malik, M-H., Yan, P., Paik, K-W. & Roshanghias, A., 2 Jan 2021, In: Journal of Materials Science: Materials in Electronics. 32

  Research output: Contribution to journal › Article › peer-review

  • polyethylene terephthalate 100%
  • electronics 46%
  • cycles 44%
  • chips 35%
  • kits 31%

• Comparison of the parasitic Impedances from the Drain-Source Path of Power Transistor Packages at up to 2 GHz

  Moldaschl, T., Woetzel, S., Latella, R., Galvano, I. & Binder, A., 2021, In: Engineering Reports.

  Research output: Contribution to journal › Article › peer-review

  • transistors 100%
  • impedance 95%
  • method of moments 49%
  • gallium nitrides 48%
  • inductance 44%

• Cu Pillar Planarization to Enhance Thermosonic Flipchip Bonding: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)

  Roshanghias, A., Rodrigues, A., Kaczynski, J., Binder, A. & Schmidt, A., 1 Nov 2021, p. 1-3. 3 p.

  Research output: Contribution to conference (No Proceedings) › Paper › peer-review

  • packaging 100%
  • microelectronics 96%
  • coplanarity 51%
  • chips 37%
  • wafers 23%

• Evaluation of low cost sealing methods to protect sustainable printed temperature sensors against degradation due to UV irradiation

  Rauter, L., Zikulnig, J., Malik, M. H., Khan, S., Faller, L-M., Zangl, H. & Kosel, J., 23 Aug 2021, (Accepted/In press). 4 p.

  Research output: Contribution to conference (No Proceedings) › Paper › peer-review

• Flip Chip integration of ultra-thinned dies in low-cost flexible printed electronics; the effects of die thickness, encapsulation and conductive adhesives

  Malik, M. H., Grosso, G., Zangl, H., Binder, A. & Roshanghias, A., 1 Aug 2021, In: Microelectronics Reliability. 123, p. 114204

  Research output: Contribution to journal › Article › peer-review

  Open Access

  • Encapsulation 100%
  • Foil 88%
  • adhesives 86%
  • Adhesives 79%
  • Electronic equipment 74%

• Multiphysics Reduced Order Modelling of a Packaged Laser Diode

  Grosso, G., Moldaschl, T., Fuger, R. & Binder, A., 2021, (Accepted/In press) IEEE Therminic 2021 Proceeedings.

  Research output: Conference proceeding/Chapter in Book/Report/ › Conference Paper › peer-review

• Optimization of Resonant PZT MEMS Mirrors by Inverse Design and Electrode Segmentation

  Piot, A., Pribosek, J., Maufay, J., Schicker, J., Tortschanoff, A., Matloub, R., Muralt, P. & Moridi, M., 1 Apr 2021, In: Journal of Microelectromechanical Systems. 30, 2, p. 216-223

  Research output: Contribution to journal › Article › peer-review

• Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging

  Roshanghias, A., Malago, P., Kaczynski, J., Polom, T., Bardong, J., Holzmann, D., Malik, M-H., Ortner, M., Hirschl, C. & Binder, A., 13 Apr 2021, In: Energies. 14, 8

  Research output: Contribution to journal › Article › peer-review

  Open Access

  • Interconnect 100%
  • Packaging 95%
  • Copper 94%
  • Interconnection 50%
  • Module 45%

• Two-Way Coupled Thermal-Electric Simulation of a Packaged Laserdiode using Reduced Order Models

  Moldaschl, T., Grosso, G., Fuger, R. & Binder, A., Oct 2021.

  Research output: Contribution to conference (No Proceedings) › Abstract › peer-review

  • simulation 100%
  • semiconductor lasers 67%
  • quantum well lasers 49%
  • copper 31%
  • thermal simulation 30%
• 2020

  Computationally efficient model for viscous damping in perforated MEMS structures

  Kaczynski, J., Ranacher, C. & Fleury, C., 2020, In: Sensors and Actuators A: Physical. 2020, 112201

  Research output: Contribution to journal › Article › peer-review

• Evaluation of Standard Electrical Bonding Strategies for the Hybrid Integration of Inkjet-Printed Electronics

  Rauter, L., Zikulnig, J., Sinani, T., Zangl, H. & Faller, L-M., 30 Aug 2020, In: Electronic Materials.

  Research output: Contribution to journal › Article › peer-review