TY - JOUR
T1 - High temperature MEMS packages: die-attach solutions for LiNbO3 under low bonding pressures
AU - Roshanghias, A.
AU - Bruckner, G.
AU - Binder, A.
PY - 2017
Y1 - 2017
N2 - A survey of high temperature die-attach solutions for lithium niobate (LiNbO3) single crystals was conducted and based on that three promising approaches; i.e. eutectic solder, silver sinter-paste and silver-loaded conductive adhesive; were proposed and investigated. A relatively low pressure span (0–4 MPa) was employed, aiming to mitigate the risk of fracture in the brittle die. The mechanical properties of the corresponding die-attach assemblies was examined by a die-shear tester and the reliability of the joints was assessed after isothermal aging at 300 °C. The micro-structural integrity of the bonding was also analyzed by cross-sectional microscopy. The results revealed that silver sinter paste die-attach possesses superior shear strength in comparison to the two other techniques. Cross-sectional failure analysis also indicated a ductile fracture mode throughout the bonding layer for silver-paste and adhesive joints, whereas in soldered assemblies a brittle fracture mode along the interfacial intermetallic compound layer was predominant.
AB - A survey of high temperature die-attach solutions for lithium niobate (LiNbO3) single crystals was conducted and based on that three promising approaches; i.e. eutectic solder, silver sinter-paste and silver-loaded conductive adhesive; were proposed and investigated. A relatively low pressure span (0–4 MPa) was employed, aiming to mitigate the risk of fracture in the brittle die. The mechanical properties of the corresponding die-attach assemblies was examined by a die-shear tester and the reliability of the joints was assessed after isothermal aging at 300 °C. The micro-structural integrity of the bonding was also analyzed by cross-sectional microscopy. The results revealed that silver sinter paste die-attach possesses superior shear strength in comparison to the two other techniques. Cross-sectional failure analysis also indicated a ductile fracture mode throughout the bonding layer for silver-paste and adhesive joints, whereas in soldered assemblies a brittle fracture mode along the interfacial intermetallic compound layer was predominant.
UR - http://www.scopus.com/inward/record.url?eid=2-s2.0-85013825827&partnerID=MN8TOARS
U2 - 10.1007/s10854-017-6605-3
DO - 10.1007/s10854-017-6605-3
M3 - Article
SP - 8784
EP - 8792
JO - Journal of Materials Science: Materials in Electronics
JF - Journal of Materials Science: Materials in Electronics
IS - 12
ER -