| Original language | English |
|---|---|
| Journal | SN Applied Sciences |
| DOIs | |
| Publication status | Published - Jun 2020 |
Thermosonic direct Cu pillar bonding for 3D die stacking
A. Roshanghias, A. Rodrigues, S. Schwarz, A. Steiger-Thirsfeld
Research output: Contribution to journal › Article › peer-review