TY - JOUR
T1 - Exploiting the combination of 3D polymer printing and inkjet Ag-nanoparticle printing for advanced packaging
AU - Krivec, M.
AU - Roshanghias, A.
AU - Abram, A.
AU - Binder, A.
PY - 2017/5/25
Y1 - 2017/5/25
N2 - A rapid advanced packaging concept, consisting of 3D photopolymer printing and Ag nanoparticle printing, was investigated for the construction of a simple radio frequency identification (RFID) package with integrated surface acoustic wave transponder (SAW). An acrylate-type SAW package housing was printed with a multi-jet 3D printer and the corresponding antenna for the wireless read-out was manufactured via inkjet printing of Ag nanoparticle ink. The corresponding Ag structure had a thickness of about 2 μm with a sheet resistance of 250 mΩ sq− 1 after the photonic sintering processing. The chip-on-board and flip-chip packaging concepts were pursued for connecting the antenna structure to the chip pads. The SAW package prototype in a flip-chip configuration showed a significant signal to noise ratio (SNR) of about 30 dB via antenna-bridged radio frequency link at a moderate distance of 3 cm.
AB - A rapid advanced packaging concept, consisting of 3D photopolymer printing and Ag nanoparticle printing, was investigated for the construction of a simple radio frequency identification (RFID) package with integrated surface acoustic wave transponder (SAW). An acrylate-type SAW package housing was printed with a multi-jet 3D printer and the corresponding antenna for the wireless read-out was manufactured via inkjet printing of Ag nanoparticle ink. The corresponding Ag structure had a thickness of about 2 μm with a sheet resistance of 250 mΩ sq− 1 after the photonic sintering processing. The chip-on-board and flip-chip packaging concepts were pursued for connecting the antenna structure to the chip pads. The SAW package prototype in a flip-chip configuration showed a significant signal to noise ratio (SNR) of about 30 dB via antenna-bridged radio frequency link at a moderate distance of 3 cm.
KW - Additive manufacturing
KW - Inkjet printing
KW - Rapid advanced packaging
KW - SAW package
UR - https://www.mendeley.com/catalogue/231c1dd7-c752-3ec0-b253-da26ba5aba8e/
U2 - 10.1016/j.mee.2016.12.021
DO - 10.1016/j.mee.2016.12.021
M3 - Article
VL - 176
SP - 1
EP - 5
JO - Microelectronic Engineering
JF - Microelectronic Engineering
ER -