Sinter bonding of inkjet-printed Ag die-attach as an alternative to Ag paste

Research output: Contribution to journal › Article › peer-review

Original language	English
Journal	Journal of Materials Science: Materials in Electronics
DOIs	https://doi.org/10.1007/s10854-018-9234-6
Publication status	Published - 8 Jul 2018

Access to Document

TY - JOUR

T1 - Sinter bonding of inkjet-printed Ag die-attach as an alternative to Ag paste

AU - Roshanghias, Ali

PY - 2018/7/8

Y1 - 2018/7/8

UR - https://doi.org/10.1007/s10854-018-9234-6

U2 - 10.1007/s10854-018-9234-6

DO - 10.1007/s10854-018-9234-6

M3 - Article

JO - Journal of Materials Science: Materials in Electronics

JF - Journal of Materials Science: Materials in Electronics

ER -