On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers

Ali Roshanghias; Marc Dreissigacker; Christina Scherf; Christian Bretthauer; Lukas Rauter; Johanna Zikulnig; Tanja Braun; Karl-F Becker; Sven Rzepka; Martin Schneider-Ramelow

doi:10.3390/mi11060564

On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers

Ali Roshanghias, Marc Dreissigacker, Christina Scherf, Christian Bretthauer, Lukas Rauter, Johanna Zikulnig, Tanja Braun, Karl-F Becker, Sven Rzepka, Martin Schneider-Ramelow

Sensor Applications (SEA)

Research output: Contribution to journal › Article › peer-review

Original language	English
Journal	Micromachines
DOIs	https://doi.org/10.3390/mi11060564
Publication status	Published - 31 May 2020

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10.3390/mi11060564

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title = "On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers",

author = "Ali Roshanghias and Marc Dreissigacker and Christina Scherf and Christian Bretthauer and Lukas Rauter and Johanna Zikulnig and Tanja Braun and Karl-F Becker and Sven Rzepka and Martin Schneider-Ramelow",

year = "2020",

month = may,

day = "31",

doi = "10.3390/mi11060564",

language = "English",

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TY - JOUR

T1 - On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers

AU - Roshanghias, Ali

AU - Dreissigacker, Marc

AU - Scherf, Christina

AU - Bretthauer, Christian

AU - Rauter, Lukas

AU - Zikulnig, Johanna

AU - Braun, Tanja

AU - Becker, Karl-F

AU - Rzepka, Sven

AU - Schneider-Ramelow, Martin

PY - 2020/5/31

Y1 - 2020/5/31

UR - https://doi.org/10.3390/mi11060564

U2 - 10.3390/mi11060564

DO - 10.3390/mi11060564

M3 - Article

JO - Micromachines

JF - Micromachines

ER -

On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers

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