Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles

A. Yakymovych; Y. Plevachuk; P. Švec; P. Švec; D. Janičkovič; P. Šebo; N. Beronská; A. Roshanghias; H. Ipser

doi:10.1007/s11664-016-4832-7

Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles

A. Yakymovych, Y. Plevachuk, P. Švec, P. Švec, D. Janičkovič, P. Šebo, N. Beronská, A. Roshanghias, H. Ipser

Research output: Contribution to journal › Article › peer-review

Original language	English
Journal	Journal of Electronic Materials
DOIs	https://doi.org/10.1007/s11664-016-4832-7
Publication status	Published - 2016

Access to Document

10.1007/s11664-016-4832-7

Cite this

@article{400fce8a76904eb69cdfe08d01f0978e,

title = "Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles",

author = "A. Yakymovych and Y. Plevachuk and P. {\v S}vec and P. {\v S}vec and D. Jani{\v c}kovi{\v c} and P. {\v S}ebo and N. Beronsk{\'a} and A. Roshanghias and H. Ipser",

year = "2016",

doi = "10.1007/s11664-016-4832-7",

language = "English",

}

TY - JOUR

T1 - Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles

AU - Yakymovych, A.

AU - Plevachuk, Y.

AU - Švec, P.

AU - Janičkovič, D.

AU - Šebo, P.

AU - Beronská, N.

AU - Roshanghias, A.

AU - Ipser, H.

PY - 2016

Y1 - 2016

UR - http://www.scopus.com/inward/record.url?eid=2-s2.0-84982931603&partnerID=MN8TOARS

U2 - 10.1007/s11664-016-4832-7

DO - 10.1007/s11664-016-4832-7

M3 - Article

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

ER -

Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles

Access to Document

Other files and links

Cite this