Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8Ag–0.7Cu solders by adding Co nanoparticles

A. Yakymovych; Y. Plevachuk; P. Švec; D. Janičkovič; P. Šebo; N. Beronská; M. Nosko; L. Orovcik; A. Roshanghias; H. Ipser

doi:10.1007/s10854-017-6877-7

Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8Ag–0.7Cu solders by adding Co nanoparticles

A. Yakymovych, Y. Plevachuk, P. Švec, D. Janičkovič, P. Šebo, N. Beronská, M. Nosko, L. Orovcik, A. Roshanghias, H. Ipser

Research output: Contribution to journal › Article › peer-review

Original language	English
Journal	Journal of Materials Science: Materials in Electronics
DOIs	https://doi.org/10.1007/s10854-017-6877-7
Publication status	Published - 2017

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10.1007/s10854-017-6877-7

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Yakymovych, A., Plevachuk, Y., Švec, P., Janičkovič, D., Šebo, P., Beronská, N., Nosko, M., Orovcik, L., Roshanghias, A., & Ipser, H. (2017). Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8Ag–0.7Cu solders by adding Co nanoparticles. Journal of Materials Science: Materials in Electronics. https://doi.org/10.1007/s10854-017-6877-7

@article{e1cb20c37b13490aba7d498997ac8fc4,

title = "Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8Ag–0.7Cu solders by adding Co nanoparticles",

author = "A. Yakymovych and Y. Plevachuk and P. {\v S}vec and D. Jani{\v c}kovi{\v c} and P. {\v S}ebo and N. Beronsk{\'a} and M. Nosko and L. Orovcik and A. Roshanghias and H. Ipser",

year = "2017",

doi = "10.1007/s10854-017-6877-7",

language = "English",

}

TY - JOUR

T1 - Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8Ag–0.7Cu solders by adding Co nanoparticles

AU - Yakymovych, A.

AU - Plevachuk, Y.

AU - Švec, P.

AU - Janičkovič, D.

AU - Šebo, P.

AU - Beronská, N.

AU - Nosko, M.

AU - Orovcik, L.

AU - Roshanghias, A.

AU - Ipser, H.

PY - 2017

Y1 - 2017

UR - http://www.scopus.com/inward/record.url?eid=2-s2.0-85017150337&partnerID=MN8TOARS

U2 - 10.1007/s10854-017-6877-7

DO - 10.1007/s10854-017-6877-7

M3 - Article

JO - Journal of Materials Science: Materials in Electronics

JF - Journal of Materials Science: Materials in Electronics

ER -

Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8Ag–0.7Cu solders by adding Co nanoparticles

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