Research output per year
Research output per year
Personal profile
Research interests
- Die-attach applications
- Heterogeneous and 3D chip integration
- Cu-pillar based interconnection
- Wafer level packaging
- Wafer bonding process.
Fingerprint
Dive into the research topics where Augusto Daniel Rodrigues is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 1 Similar Profiles
Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
-
3D Integration via D2D Bump-Less Cu Bonding with Protruded and Recessed Topographies
Roshanghias, A., Kaczynski, J., Rodrigues, A. D., Karami, R., Pires, M., Burggraf, J. & Schmidt, A., 2 Aug 2023, In: ECS Journal of Solid State Science and Technology. 15 p., JSS-103386.R2.Research output: Contribution to journal › Article › peer-review
Open Access -
Efficient Xe Filling of MEMS Vapor Cells Empowered by Customized Triple Stack Wafer Bond Processing
Roshanghias, A., Kaczynski, J., Rodrigues, A., Hübner, M., Zauner, M., Grosso, G., Andrianov, N., Khan, M., Grömer, T., Fuchs, T. & Binder, A., 29 Sept 2023, In: ECS Transactions.Research output: Contribution to journal › Article › peer-review
-
Direct flip-chip bonding of bare dies to polypropylene-coated paper substrates without adhesives or solders
Rodrigues, A. D., Weissbach, T., Malik, M. H., Schmidt, W., Gumbiowski, R., Hübler, A., Binder, A. & Roshanghias, A., 26 Jul 2022, In: Journal of Materials Science: Materials in Electronics.Research output: Contribution to journal › Article › peer-review
Open Access -
Hybrid Integration of fine-pitch bare dies on polypropylene-coated paper substrates without using any adhesives or solders
Rodrigues, A. D., Weissbach, T., Malik, M. H., Schmidt, W., Gumbiowski, R., C. Hübler, A., Binder, A. & Roshanghias, A., 22 Mar 2022, p. 1. 1 p.Research output: Contribution to conference (No Proceedings) › Poster
-
Cu Pillar Planarization to Enhance Thermosonic Flipchip Bonding: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)
Roshanghias, A., Rodrigues, A., Kaczynski, J., Binder, A. & Schmidt, A., 1 Nov 2021, p. 1-3. 3 p.Research output: Contribution to conference (No Proceedings) › Paper › peer-review