Die-Level Thinning for Flip-Chip Integration on Flexible Substrates

Muhammad Hassan Malik, Andreas Tsiamis, Hubert Zangl, Alfred Binder, Srinjoy Mitra, Ali Roshanghias

Research output: Contribution to journalArticlepeer-review

Original languageUndefined/Unknown
JournalElectronics
DOIs
Publication statusPublished - 8 Mar 2022

Cite this