Original language | Undefined/Unknown |
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Journal | Electronics |
DOIs | |
Publication status | Published - 8 Mar 2022 |
Die-Level Thinning for Flip-Chip Integration on Flexible Substrates
Muhammad Hassan Malik, Andreas Tsiamis, Hubert Zangl, Alfred Binder, Srinjoy Mitra, Ali Roshanghias
Research output: Contribution to journal › Article › peer-review