Evaluating Cu Printed Interconnects “Sinterconnects” versus Wire Bonds for Switching Converters

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@article{24efe6f876bf49c48bdaa65ba40ce31e,

title = "Evaluating Cu Printed Interconnects “Sinterconnects” versus Wire Bonds for Switching Converters",

author = "Hasan, {Md Nazmul} and Timothy Polom and Dominik Holzmann and Perla Malag{\'o} and Alfred Binder and Ali Roshanghias",

year = "2022",

month = apr,

day = "25",

doi = "10.3390/electronics11091373",

language = "undefiniert/unbekannt",

}

TY - JOUR

T1 - Evaluating Cu Printed Interconnects “Sinterconnects” versus Wire Bonds for Switching Converters

AU - Hasan, Md Nazmul

AU - Polom, Timothy

AU - Holzmann, Dominik

AU - Malagó, Perla

AU - Binder, Alfred

AU - Roshanghias, Ali

PY - 2022/4/25

Y1 - 2022/4/25

UR - https://doi.org/10.3390/electronics11091373

U2 - 10.3390/electronics11091373

DO - 10.3390/electronics11091373

M3 - Artikel

JO - Electronics

JF - Electronics

ER -