Projects per year
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Dive into the research topics where Ali Roshanghias is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Collaborations and top research areas from the last five years
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Nano4E: Integrated thermo-optically activated Nanosensors for environmental monitoring
1/05/23 → 30/04/26
Project: Research
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ALL2GaN: Affordable smart GaN IC solutions as enabler of greener applications
1/01/23 → 1/12/25
Project: Research
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PowerizeD: Digitalization of Power Electronic Applications within Key Technology Value Chains
1/01/23 → 1/12/25
Project: Research
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IMPETUS: Pilot line for paper based electrochemical test strips dedicated to quantitative biosensing in liquids
1/05/20 → 30/06/22
Project: Research
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Magnetic Field Sensors for Non-Invasive Current Monitoring in Wire-Bond-Less Power Modules
Malagò, P., Lumetti, S., Holzmann, D., Ortner, M. & Roshanghias, A., 27 Mar 2024, MDPI - Proceedings 2024.Research output: Conference proceeding/Chapter in Book/Report/ › Conference Paper › peer-review
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3D Integration via D2D Bump-Less Cu Bonding with Protruded and Recessed Topographies
Roshanghias, A., Kaczynski, J., Rodrigues, A. D., Karami, R., Pires, M., Burggraf, J. & Schmidt, A., 2 Aug 2023, In: ECS Journal of Solid State Science and Technology. 15 p., JSS-103386.R2.Research output: Contribution to journal › Article › peer-review
Open Access -
Efficient Xe Filling of MEMS Vapor Cells Empowered by Customized Triple Stack Wafer Bond Processing
Roshanghias, A., Kaczynski, J., Rodrigues, A., Hübner, M., Zauner, M., Grosso, G., Andrianov, N., Khan, M., Grömer, T., Fuchs, T. & Binder, A., 29 Sept 2023, In: ECS Transactions.Research output: Contribution to journal › Article › peer-review
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Fabrication and Characterization of Printed Phototransistors Based on Monochalcogenide Inks
Odaci, C., Mühleisen, W., Aydemir, U. & Roshanghias, A., 4 Apr 2023, In: ACS Applied Electronic Materials.Research output: Contribution to journal › Article › peer-review
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Flip Chip Bonding on Stretchable Printed Substrates; The Effects of Stretchable Material and Chip Encapsulation
Malik, M. H., Kaczynski, J., Zangl, H. & Roshanghias, A., 24 Jan 2023, In: Flexible and Printed Electronics. 8, 1Research output: Contribution to journal › Article › peer-review
Open AccessFile