Research output per year
Research output per year
- 11 results
Search results
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2023
Soft mask-based dry etching of parylene AF4 for advanced packaging applications
Bellaredj, M. L. F., Andrianov, N., Kaufhold, R. & Miskovic, G., 18 Jan 2023, p. 109. 113 p.Research output: Contribution to conference (No Proceedings) › Paper › peer-review
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2021
Cu Pillar Planarization to Enhance Thermosonic Flipchip Bonding: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)
Roshanghias, A., Rodrigues, A., Kaczynski, J., Binder, A. & Schmidt, A., 1 Nov 2021, p. 1-3. 3 p.Research output: Contribution to conference (No Proceedings) › Paper › peer-review
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Evaluation of low cost sealing methods to protect sustainable printed temperature sensors against degradation due to UV irradiation
Rauter, L., Zikulnig, J., Malik, M. H., Khan, S., Faller, L-M., Zangl, H. & Kosel, J., 23 Aug 2021, (Accepted/In press). 4 p.Research output: Contribution to conference (No Proceedings) › Paper › peer-review
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2020
Resonant PZT MEMS Mirror with Segmented Electrodes
Piot, A., Pribosek, J., Maufay, J., Schicker, J., Tortschanoff, A., Matloub, R., Muralt, P. & Moridi, M., Jan 2020, p. 517-520.Research output: Contribution to conference (No Proceedings) › Paper › peer-review
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2018
Analysis of Single- and Double Core Planar Fluxgate Structures
Navaeio, N., Roshanghias, A., Lenzhofer, M. & Ortner, M., 2018.Research output: Contribution to conference (No Proceedings) › Paper › peer-review
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2017
Implantable wireless pressure sensor
Binder, A., Nicolay, P., Lenzhofer, M., Stocksreiter, W., Schlumpf, P. & Stojanov, V., 2017.Research output: Contribution to conference (No Proceedings) › Paper › peer-review
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2014
A Wireless and Passive Embeddable Low-Pressure Sensor
Nicolay, P., Krall, C., Lenzhofer, M. & Bruckner, G., 2014.Research output: Contribution to conference (No Proceedings) › Paper › peer-review
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Design and characterisation of a combined pressure, temperature, ID sensor for harsh environment
Binder, A., Bardong, J. & Bruckner, G., Sept 2014, p. 1513-1516.Research output: Contribution to conference (No Proceedings) › Paper › peer-review
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2012
Combined experimental and simulatory evaluation of thermal and mechanical loads on pv modules
Hirschl, C., Granitzer, M., Neumaier, L., Spielberger, M., Mühleisen, W., Kraft, M., Kroupa, G. & Schicker, J., 2012. 5 p.Research output: Contribution to conference (No Proceedings) › Paper › peer-review
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2008
Integriertes SAW RF-ID & Sensorsystem für hohe Temperaturen
Translated title of the contribution :Integrated SAW RF-ID & sensing System for high Temperatures Research output: Contribution to conference (No Proceedings) › Paper
Open AccessFile -
2003
Thin Wafer Pre-Align Gripping System – A new mechatronic approach to semiconductor handling
Binder, A., Franz, G., Lenzhofer, M. & Soucek, M., 2003.Research output: Contribution to conference (No Proceedings) › Paper › peer-review