Calculation of the resistance of silver-based backside metallization stack for die-attach packaging applications

Perla Malago, Goran Miskovic, Mohamed Lamine Faycal Bellaredj

Research output: Contribution to journal › Conference article › peer-review

Original language	English
Journal	IEEE Xplore
DOIs	https://doi.org/10.1109/ISSE57496.2023.10168500 https://doi.org/10.1109/ISSE57496.2023.10168500
Publication status	Published - 6 Jul 2023

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@article{801ded37bf5b4241bdb1db3357732aaa,

title = "Calculation of the resistance of silver-based backside metallization stack for die-attach packaging applications",

author = "Perla Malago and Goran Miskovic and Bellaredj, {Mohamed Lamine Faycal}",

year = "2023",

month = jul,

day = "6",

doi = "10.1109/ISSE57496.2023.10168500",

language = "English",

}

TY - JOUR

T1 - Calculation of the resistance of silver-based backside metallization stack for die-attach packaging applications

AU - Malago, Perla

AU - Miskovic, Goran

AU - Bellaredj, Mohamed Lamine Faycal

PY - 2023/7/6

Y1 - 2023/7/6

U2 - 10.1109/ISSE57496.2023.10168500

DO - 10.1109/ISSE57496.2023.10168500

M3 - Conference article

SN - 2161-2536

JO - IEEE Xplore

JF - IEEE Xplore

ER -