Soft mask-based dry etching of parylene AF4 for advanced packaging applications

Mohamed Lamine Faycal Bellaredj, Nikolai Andrianov, Robin Kaufhold, Goran Miskovic

Research output: Contribution to conference (No Proceedings)Paperpeer-review

Abstract

In this work, an alternative dry etching approach for parylene AF4 is presented based on a photoresist soft mask, which results in a relatively simpler, faster, cheaper and environmentally friendly process in comparison to the typical dry etching process with a hard mask. 2.5 µm thick parylene AF4 was deposited on a silicon (Si) substrate by vapor deposition polymerization (VDP). A 5 µm thick photoresist was used as a soft mask, while parylene AF4 patterning was done using an oxygen (O 2 )-argon (Ar) inductively coupled plasma reactive ion etching (ICP-RIE) process. The AF4:photoresist selectivity was around 1 while the AF 4 etching rate was roughly 275 nm/min for an Ar/02 ratio of 0.1 at 20mTorr and ICP:CCP powers of 1000W:50W respectively. The influence of the ICP plasma parameters on the AF 4 etching rate was investigated and the results suggested a predominant oxygen radicals-based reactive chemical etching mechanism.
Original languageEnglish
Pages109
Number of pages113
Publication statusPublished - 18 Jan 2023
Event2022 IEEE 24th Electronics Packaging Technology Conference (EPTC): EPTC - Singapore, Singapore, Singapore, Singapore
Duration: 7 Dec 20229 Dec 2022
Conference number: 24th
http://2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

Conference

Conference2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
Abbreviated titleEPTC
Country/TerritorySingapore
CitySingapore
Period7/12/229/12/22
Internet address

Keywords

  • Dry etching
  • advanced packaging

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