Ultra-Thin Chips (UTC) Integration on Inkjet-Printed Papers

Research output: Conference proceeding/Chapter in Book/Report/Conference Paperpeer-review

Abstract

Paper as a substrate for electronic circuits with inkjet printing of conductors and insulators offers advantages such as low-cost, flexibility, eco-friendliness, and recyclability. To realize circuitry on papers, inkjet printing is one of the standard methodologies. However, heterogeneous integration of components on inkjet printed papers has faced reliability issues; therefore, inkjet printing is still not the mainstream in the fabrication of electronic papers (E-papers). Accordingly, in this study, the feasibility and reliability of integrating ultra-thin chips (UTC) on inkjet printed papers were discussed and analyzed. The significant effects of printed layer thickness on both electrical performance and long-term stability of the E-papers were demonstrated. The results were also compared to screen-printed papers.
Original languageEnglish
Title of host publicationUltra-Thin Chips (UTC) Integration on Inkjet-Printed Papers
Pages1-4
DOIs
Publication statusPublished - 30 Jun 2022

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