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Konferenzartikel
Improvement of manufacture technology and investigation of IPMC actuator electrodes
Khmelnitskiy, I. K., Vereschagina, L. O., Kalyonov, V. E., Lagosh, A. V. & Broyko, A. P., 2017, Proceedings of the 2017 IEEE Russia Section Young Researchers in Electrical and Electronic Engineering Conference, ElConRus 2017.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Improvement of manufacture technology and research of actuators based on ionic polymer-metal composites
Khmelnitskiy, I. K., Vereshagina, L. O., Kalyonov, V. E., Broyko, A. P., Lagosh, A. V., Luchinin, V. V. & Testov, D. O., 2017, Journal of Physics: Conference Series.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Improvement of SPICE based ESD Protection Models for I/O Protection Modeling
Pak, A., Mousavi, S. M., Pommerenke, D., Maghlakelidze, G. & Xu, Y., 13 Aug. 2021, 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium. S. 1006-1011 6 S. 9559224Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Improving communication reliability in intelligent transport systems through cooperative driving
Blazek, T., Mecklenbräuker, C. F., Backfrieder, C. & Ostermayer, G., 27 Sep. 2017, 2017 10th IFIP Wireless and Mobile Networking Conference (WMNC). IEEE Computer Society, S. 1-6 6 S. 8248849Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Improving kinetic energy storage for vehicles through the combination of rolling element and active magnetic bearings
Recheis, M., Buchroithner, A., Andrasec, I., Gallien, T., Schweighofer, B., Bader, M. & Wegleiter, H., 13 Nov. 2013, IECON 2013 - 39th Annual Conference of the IEEE Industrial Electronics Society. S. 4641-4646 6 S. 6699884Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Improving magnetic linear position measurement by field shaping
Ortner, M., 2015, International Conference on Sensing Technology, ICST.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Increasing the Bandwidth Efficiency in UW-OFDM
Lang, O., Böck, C., Huemer, M. & Hofbauer, C., 6 Nov. 2019, 2019 53rd Asilomar Conference on Signals, Systems, and Computers. IEEE Computer Society, S. 1857-1861 5 S. 9048927Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Inductor Current Envelope Based TCM/ZVS Operation of a High Switching Frequency Single-Phase AC/DC Converter
Langbauer, T., Connaughton, A., Scheffauer, M., Vollmaier, F., Pang, Y. & Krischan, K., 8 Dez. 2022, 2022 IEEE 7th Southern Power Electronics Conference (SPEC). S. 1-6 6 S. 10058452Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Industrial IoT Security Concept with Extended ISO/IEC/IEEE 21450 TEDS
Mitterer, T., Hormann, L. B., Bernhard, H., Priller, P. & Zangl, H., 18 Okt. 2020, IECON 2020 - 46th Annual Conference of the IEEE Industrial Electronics Society. S. 5232-5237 6 S.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Industrial Raman mapping spectroscopy for mining applications
Biasio, M. D., Arnold, T., McGunnigle, G., Leitner, R., Tortschanoff, A., Fietz, N., Weitkämper, L., Balthasar, D. & Rehrmann, V., 2012, Next-Generation Spectroscopic Technologies V. Druy, M. A. & Crocombe, R. A. (Hrsg.). Band 8374. S. 214 - 219Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Influence of nonlinear resistive loads on the resonance behavior of NFC systems
Gruber, T., Baumgartner, P., Bauernfeind, T. & Reinbacher-Köstinger, A., 2022, The 20th International IGTE Symposium on Computational Methods in Electromagnetics and Multiphysics - Abstracts.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Influence of packaging atmospheres on the durability of high-temperature SAW sensors
Bardong, J., Bruckner, G., Kraft, M. & Fachberger, R., 2009, 2009 IEEE International Ultrasonics Symposium. S. 1680-1683 4 S.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel
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Influence of temperature and humidity on carbon based printed flexible sensors
Nag, A., Mukhopadhyay, S. & University, K., 2017, 2017 Eleventh International Conference on Sensing Technology (ICST). S. 1-6 6 S.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Information-Seeking in Localization and Mission Planing of Multi-Agent Systems
Lite, K. & Rinner, B., 2022, In Proc. IEEE Multimedia Information Processing and Retrieval.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Inline inspection of CIGS solar cells by means of Raman spectroscopy and photoluminescence imaging
Biasio, M. D., Mühleisen, W., Zikulnig, J., Kraft, M., Simor, M. & Bolt, P., 2021, Next-Generation Spectroscopic Technologies XIV. Profeta, L. T. M., O'Hara, J. F. & Barnett, S. M. (Hrsg.). Band 11725. S. 8 - 14Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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In-pixel voltage-controlled ring-oscillator for phase interpolation in ToF image sensors
Vornicu, I., Carmona-Galan, R. & Rodriguez-Vazquez, A., 2016, Proceedings - IEEE International Symposium on Circuits and Systems.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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In-process deformation measurements of translucent high speed fibre-reinforced disc rotors
Philipp, K., Filippatos, A., Koukourakis, N., Kuschmierz, R., Leithold, C., Langkamp, A., Fischer, A. & Czarske, J., 17 Juli 2015, in: International Conference on Optical and Photonic Engineering (icOPEN 2015).Publikation: Beitrag in Fachzeitschrift › Konferenzartikel › Begutachtung
Open AccessDatei -
Inspection of mechanical and electrical properties of silicon wafers using terahertz tomography and spectroscopy
Arnold, T., Muehleisen, W., Schicker, J. & Hirschl, C., 2015, Proceedings of SPIE - The International Society for Optical Engineering.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Inspection of packaged integrated circuits using
Radiation, T., Fritz, A. & Arnold, T., 2014, Proceedings of the International Conference on Sensing Technology, ICST.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Integrated Camera and Radar Tracking using Multi-Model Cubature Kalman Filter
Bhuvana, V. P. & Huemer, M., 14 Nov. 2019, 2019 IEEE Global Conference on Signal and Information Processing (GlobalSIP). IEEE Computer Society, S. 1-5 5 S. 8969484. (IEEE Global Conference on Signal and Information Processing).Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Integrated packaging of 2D MOEMS mirrors with optical position feedback
Baumgart, M., Lenzhofer, M., Kremer, M. P. & Tortschanoff, A., 2015, Proceedings of SPIE - The International Society for Optical Engineering.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Integrated passive and wireless sensor for magnetic fields, temperature and humidity
Li, B., Yassine, O. & Technology, K. A. U. O. S., 2013, SENSORS, 2013 IEEE. S. 1-4 4 S.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Integrated tracking and focusing micro lens actuators based on silicon bulk micromachining
Li, P., Sasaki, T., Pan, L. F. & Hane, K., 2011, 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel
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Integration of a High Temperature Transition Metal Oxide NTC Thin Film in a Microbolometer for LWIR Detection
Risquez, S., Redolfi, S., Fleury, C., Wulf, M., Roshanghias, A., Piot, A., Streque, J., Schmoltner, K., Dao, T. D., Puff, M. & Moridi, M., 2023, Integration of a High Temperature Transition Metal Oxide NTC Thin Film in a Microbolometer for LWIR Detection.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Integration of III-V light sources on a silicon photonics circuit by transfer printing
Cassese, T., Aug. 2017, Integration of III-V light sources on a silicon photonics circuit by transfer printing.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Integration of ISO/IEC/IEEE 21450 Transducer Electronic Datasheets into OPC UA Information Model
Shakil, M., Zoitl, A., Atiq, M. K. & Bernhard, H. P., 9 Juni 2021, 17th IEEE International Conference on Factory Communication Systems (WFCS). IEEE Computer Society, S. 159-166 8 S. 9483596Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Integration of openSAFETY in OMNeT++
Hadziaganovic, A., Muzaffar, R., Bernhard, H-P. & Springer, A., 9 Dez. 2022, IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society. 6 S.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Integration Strategy for Standalone Compliant Interactive Systems for Add-on IoT based Electronics
Khan, S., 2019, 2019 IEEE 5th World Forum on Internet of Things (WF-IoT).Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Intelligent, Fault Tolerant Control for Autonomous Systems
Krenn, W. & Wotawa, F., 22 Juni 2007, 2007 Fifth Workshop on Intelligent Solutions in Embedded Systems. S. 194-205 12 S. 4408488Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Introducing molecular selectivity in rapid impedimetric sensing of phthalates
Zia, A. I., Mukhopadhyay, S. C., Al-Bahadly, I. H., Yu, P-L., Gooneratne, C. P. & Technology, K. A. U. O. S., 2014, 2014 IEEE international instrumentation and measurement technology conference (I2MTC) proceedings. S. 838-843 6 S.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Investigation of charge carrier dynamics in silicon wafers using terahertz imaging spectroscopy
Arnold, T., De Biasio, M., Mühleisen, W. & Leitner, R., 2012, 2012 IEEE I2MTC - International Instrumentation and Measurement Technology Conference, Proceedings.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Investigation of electromechanical parameters of IPMC-sensors
Khmelnitskiy, I. K., Gorodilov, V. V., Kalyonov, V. E., Lagosh, A. V. & Broyko, A. P., 1 Feb. 2018, 2018 IEEE Conference of Russian Young Researchers in Electrical and Electronic Engineering (EIConRus). S. 411-414 4 S. 8317121Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Investigation of new approaches for InGaN growth with high indium content for CPV application
Arif, M., Sundaram, S., Streque, J., Gmili, Y. E., Puybaret, R., Belahsene, S., Ramdane, A., Martinez, A., Patriarche, G., Fix, T., Slaoui, A., Voss, P. L., Salvestrini, J. P. & Ougazzaden, A., 2015, AIP Conference Proceedings.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Investigation of optically injected charge carrier dynamics in silicon wafers using terahertz spectroscopic imaging
Arnold, T., De Biasio, M., Muehleisen, W. & Leitner, R., 2012, Proceedings of SPIE - The International Society for Optical Engineering.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Investigation of platinum based periodic gratings on langasite
Bruckner, G., Nicolay, P., Bardong, J. & Shaposhnikov, K., 6 Sep. 2014, 2014 IEEE International Ultrasonics Symposium. S. 2043-2046 4 S. 6932262Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Investigation of potential induced degradation (PID) of solar modules from different manufacturers
Schwark, M., Berger, K., Ebner, R., Ujvari, G., Hirschl, C., Neumaier, L. & Muhleisen, W., 2013, IECON Proceedings (Industrial Electronics Conference).Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Investigations of SAW delay lines on c-plane AlN/sapphire at elevated temperatures
Bruckner, G., Bardong, J., Fachberger, R., Forsén, E. & Eisele, D., 4 Juni 2010, 2010 IEEE International Frequency Control Symposium. S. 499-502 4 S. 5556280Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Investigations of the magnetic circuit within a planar double core fluxgate sensor structure
Lenzhofer, M., Roshanghias, A., Navaei, N. & Ortner, M., 2020, Sensoren und Messsysteme - Beitrage der 19. ITG/GMA-Fachtagung.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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In vitro biosensing based on magnetically induced motion of magnetic nanoparticles
Dangl, A., Kokkinis, G., Keplinger, F. & Giouroudi, I., 2013, TechConnect Briefs: Nanotechnology 2013: Bio Sensors, Instruments, Medical, Environment and Energy. Band 3.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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In vivo measurements with a 64-channel extracellular neural recording integrated circuit
Delgado-Restituto, M., Rodríguez-Pérez, A., Darie, A. A., Rodríguez-Vázquez, Á., Soto-Sánchez, C. & Fernández-Jover, E., 10 Dez. 2014, 2014 21st IEEE International Conference on Electronics, Circuits and Systems (ICECS). S. 486-489 4 S. 7050028Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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IP2C electromechanical actuators and sensors
Khmelnitskiy, I. K., Luchinin, V. V., Kalyonov, V. E., Lagosh, A. V. & Broyko, A. P., 1 Feb. 2018, 2018 IEEE Conference of Russian Young Researchers in Electrical and Electronic Engineering (EIConRus). S. 415-418 4 S. 8317122Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Is AlN/Sapphire bilayer structure an alternative to langasite for ultra-high-temperature SAW applications?
Aubert, T., Elmazria, O., Bardong, J., Bruckner, G. & Assouar, B., 21 Okt. 2011, 2011 IEEE International Ultrasonics Symposium. S. 2082-2085 4 S. 6293309Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Iterative Detection for Unique Word OFDM
Haselmayr, W., Hofbauer, C., Etzlinger, B., Springer, A. & Huemer, M., 12 Dez. 2014, 2014 IEEE Global Communications Conference. IEEE Computer Society, S. 3261-3266 6 S. 7037309Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Joint Calibration and Tomography based on Separable Least Squares Approach with Constraints on Linear and Non-Linear Parameters
PATHURI-BHUVANA, V., SCHUSTER, S. & OCH, A., 24 Jän. 2021, 2020 28th European Signal Processing Conference (EUSIPCO). IEEE Computer Society, S. 1931-1935 5 S. 9287717. (European Signal Processing Conference; Band 2021-January).Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Joint distortion compensation for a direct upconversion transmitter with impairments
Burglechner, S., Petit, M., Springer, A. & Hueber, G., 3 Sep. 2010, 2010 IEEE International Conference on Wireless Information Technology and Systems. IEEE Computer Society, S. 1-4 4 S. 5611848Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Jump attenuation in a non-ideal system using shape memory element
Kossoski, A., Tusset, A. M., Janzen, F. C., Rocha, R. T., Balthazar, J. M., Brasil, R. M. L. R. F. & Nabarrete, A., 2018, MATEC Web of Conferences.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Lab-on-a-chip device for soil nutrient measurements
Kokkinis, G., Kriechhammer, G., Scheidl, D. & Smolka, M., 2017, CEUR Workshop Proceedings.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Large-amplitude resonant varifocal mirror with an acoustic cavity
Sasaki, T., Rayas, L., Nakazawa, K. & Hane, K., 2015, 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel
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Large Stroke Piezo MEMS Mirror for High-Speed Fourier Transform Spectroscopy.
Pribosek, J., Lagosh, A. & Auböck, G., Juli 2023, Transducers 2023.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Laser printed graphene on polyimide electrodes for magnetohydrodynamic pumping of saline fluids
Khan, M. A., Hristovski, I. R., Marinaro, G., Mohammed, H. & Technology, K. A. U. O. S., 2017, 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS). S. 1387-1390 4 S.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung