Inspection of mechanical and electrical properties of silicon wafers using terahertz tomography and spectroscopy

Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

Originalsprache	Englisch
Titel	Proceedings of SPIE - The International Society for Optical Engineering
DOIs	https://doi.org/10.1117/12.2176999
Publikationsstatus	Veröffentlicht - 2015

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@inproceedings{7b493bb380df403a9c85232a92cece43,

title = "Inspection of mechanical and electrical properties of silicon wafers using terahertz tomography and spectroscopy",

author = "T. Arnold and W. Muehleisen and J. Schicker and C. Hirschl",

year = "2015",

doi = "10.1117/12.2176999",

language = "English",

isbn = "1996756X 0277786X",

booktitle = "Proceedings of SPIE - The International Society for Optical Engineering",

}

TY - GEN

T1 - Inspection of mechanical and electrical properties of silicon wafers using terahertz tomography and spectroscopy

AU - Arnold, T.

AU - Muehleisen, W.

AU - Schicker, J.

AU - Hirschl, C.

PY - 2015

Y1 - 2015

UR - http://www.scopus.com/inward/record.url?eid=2-s2.0-84943405221&partnerID=MN8TOARS

U2 - 10.1117/12.2176999

DO - 10.1117/12.2176999

M3 - Conference Paper

SN - 1996756X 0277786X

BT - Proceedings of SPIE - The International Society for Optical Engineering

ER -