Heterogeneous Integration Technologies (HIT)

Publikationen

Publikationen pro Jahr 2001 2016 2017 2018 2022 2023 2024

• 74 Artikel
• 42 Konferenzartikel
• 11 Papier
• 5 Kapitel
• 11 Mehr
  • 5 Poster
  • 3 Abstract
  • 1 Übersichtsartikel
  • 1 Sonstiger Beitrag
  • 1 Patent

Publikationen pro Jahr

Publikationen pro Jahr

Suchergebnisse

• 2024

  Magnetic Field Sensors for Non-Invasive Current Monitoring in Wire-Bond-Less Power Modules

  Malagò, P., Lumetti, S., Holzmann, D., Ortner, M. & Roshanghias, A., 27 März 2024, MDPI - Proceedings 2024.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
• 2023

  Calculation of the resistance of silver-based backside metallization stack for die-attach packaging applications

  Malago, P., Miskovic, G. & Bellaredj, M. L. F., 6 Juli 2023, in: IEEE Xplore.

  Publikation: Beitrag in Fachzeitschrift › Konferenzartikel › Begutachtung

• Design and Multiphysics Simulation of a PCB-Embedded-Package Enclosing a Gallium Nitride System on Chip Grown on a Novel Substrate

  Pradhan, A., Moldaschl, T., Hasan, M. N., Schicker, J., Binder, A. & De Doncker, R. W., 4 Juli 2023, PCIM Europe 2023; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. VDE Verlag GmbH, S. 2075-2079 5 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • gallium nitrides 100%
  • systems-on-a-chip 63%
  • thermal simulation 59%
  • power loss 50%
  • thermal resistance 46%

• Fully Printed GaTe Based Photodetector on PET Substrate

  Odaci, C., Khan, M. S., Corzo, D., Jose, M., Roshanghias, A. & Aydemir, U., 2023, Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC), Munich, Germany, 2023. Munich, Germany

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • tellurides 100%
  • gallium 77%
  • photometers 67%
  • printing 49%
  • indium selenides 38%

• GaSe-Based Fiber Optic Sensor for Human Health Monitoring

  Odaci, C., Khan, M. S., Grüneberg, M., Beduk, T., Montagnese, M., Roshanghias, A. & Aydemir, U., 2023, 2023 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC). Munich, Germany

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • Lactate 100%
  • Chemical Species 36%
  • Cosmetic 33%
  • Refractive Index 31%
  • Charge Carrier 31%

• Integration of a High Temperature Transition Metal Oxide NTC Thin Film in a Microbolometer for LWIR Detection

  Risquez, S., Redolfi, S., Fleury, C., Wulf, M., Roshanghias, A., Piot, A., Streque, J., Schmoltner, K., Dao, T. D., Puff, M. & Moridi, M., 2023, Integration of a High Temperature Transition Metal Oxide NTC Thin Film in a Microbolometer for LWIR Detection.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • silicon nitrides 100%
  • metal oxides 98%
  • transition metals 85%
  • pixels 83%
  • membranes 75%

• Magnetic field sensors for non-invasive current monitoring in wire-bond-less power modules

  Malago, P., Lumetti, S., Holzmann, D., Ortner, M. & Roshanghias, A., 2023, Magnetic field sensors for non-invasive current monitoring in wire-bond-less power modules.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

• Non-destructive Na content analysis in bonded silicon-glass microcavities using laser-induced breakdown spectroscopy

  Bereczki, T., Cselyuszka, N., 张俞骋, Guso, E., Fugger-Schafhauser, D. M., Menezes de Oliveira, B. N., Roshanghias, A. & Andrianov, N., 2023, Optical Waveguide and Laser Sensors II,.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • laser-induced breakdown spectroscopy 100%
  • cathodes 49%
  • glass 47%
  • silicon 44%
  • cavities 37%
• 2022

  Adhesion evaluation of parylene AF4 to silicon and glass substrate

  Sinani, T. & Miskovic, G., 4 Juli 2022, 2022 45th International Spring Seminar on Electronics Technology .

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • adhesion 100%
  • wafers 88%
  • evaluation 74%
  • glass 68%
  • silicon 63%

• Detachable Ultrasonic Data Communication Through the Metal plate with NFC Technology

  Abbaszadeh, J., Pashchenko, V., Gebhart, M., Travnik, A., Bardong, J. & Moridi, M., 10 Okt. 2022, 2022 IEEE International Ultrasonics Symposium (IUS).

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • Near field communication 100%
  • Plate metal 93%
  • Ultrasonics 60%
  • Metals 45%
  • Lead zirconate titanate 43%

• Spectroscopic ellipsometry study of parylene AF4

  Solonenko, D., Petschnigg, M., Dao, T. D. & Miskovic, G., 4 Juli 2022, 2022 45th International Spring Seminar on Electronics Technology (ISSE).

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • ellipsometry 100%
  • refractivity 47%
  • optical transition 35%
  • ultraviolet radiation 33%
  • extinction 28%

• Through-Wall Acoustically Linked Temperature Sensor

  Pashchenko, V., Abbaszadeh, J., Travnik, A., Bardong, J. & Moridi, M., 10 Okt. 2022, 2022 IEEE International Ultrasonics Symposium (IUS). S. 1-4 4 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • temperature sensors 100%
  • temperature measurement 81%
  • transducers 72%
  • thermistors 57%
  • wall temperature 52%

• Ultra-Thin Chips (UTC) Integration on Inkjet-Printed Papers

  Malik, M. H., Rauter, L., Zangl, H., Binder, A. & Roshanghias, A., 30 Juni 2022, Ultra-Thin Chips (UTC) Integration on Inkjet-Printed Papers. S. 1-4

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  Open Access

  • Electronic paper 100%
  • Printing 89%
  • Fabrication 22%
  • Substrates 21%
  • Networks (circuits) 17%

• Utilizing Lateral Plate Transducer Modes for High Quality Acoustofluidics in Silicon-Based Chips

  Fuchsluger, K., De Pastina, A., Nikolai, A., Roshanghias, A., Cselyuszka, N., Mitteramskogler, K., Ecker, K., Moridi, M. & Jakoby, B., 2022, Utilizing Lateral Plate Transducer Modes for High Quality Acoustofluidics in Silicon-Based Chips. S. 1 4 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  Open Access

  • transducers 100%
  • chips 97%
  • silicon 66%
  • heat generation 36%
  • holders 34%
• 2021

  Multiphysics Reduced Order Modelling of a Packaged Laser Diode

  Grosso, G., Moldaschl, T., Fuger, R. & Binder, A., 2021, (Angenommen/Im Druck) IEEE Therminic 2021 Proceeedings.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

• 2020

  Investigations of the magnetic circuit within a planar double core fluxgate sensor structure

  Lenzhofer, M., Roshanghias, A., Navaei, N. & Ortner, M., 2020, Sensoren und Messsysteme - Beitrage der 19. ITG/GMA-Fachtagung.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

• 2019

  High-Temperature Pressure Sensor Package and Characterization of Thermal Stress in the Assembly up to 500 °C

  Subbiah, N., Feng, Q., Wilde, J. & Bruckner, G., 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC). S. 878-883 6 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel
• 2018

  Analysis of Single - and Double Core Planar Fluxgate Sensors

  Navaei, N., Roshanghias, A., Lenzhofer, M. & Ortner, M., 2018, Eurosensors 2018.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

• Flip-chip Die Attachment for High-temperature Pressure Sensor Packages up to 500 °C

  Subbiah, N., Feng, Q., Ramirez, K. A. B., Feil, N., Wilde, J. & Bruckner, G., 2018, 2018 7th Electronic System-Integration Technology Conference (ESTC). S. 1-6 6 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel

• Implementation of High-Temperature Pressure Sensor Package and Characterization up to 500°C

  Subbiah, N., Feng, Q., Frei, U., Wilde, J. & Bruckner, G., 2018, 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC). S. 355-358 4 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel

  • pressure sensors 100%
  • characterization 50%
  • sensors 41%
  • ultrasonic machining 40%
  • chips 36%

• Wireless, direct pressure sensing with saw devices at elevated temperatures

  Bruckner, G., Bardong, J., Szász, P. & Oschkera, S., 2018, 2018 IEEE International Ultrasonics Symposium (IUS). S. 1-9 9 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel
• 2017

  Non-contact measurement of silicon thin wafer warpage by THz tomography and laser triangulation

  Arnold, T., Schicker, J., Kraft, M. & Hirschl, C., 2017, Proceedings of IEEE Sensors.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
• 2016

  LiNbO3 die-attach with Au-Ge eutectic solders

  Roshanghias, A., Bruckner, G. & Binder, A., 1 Nov. 2016, 2016 IEEE CPMT Symposium Japan, ICSJ 2016. S. 181-184 4 S. (2016 IEEE CPMT Symposium Japan, ICSJ 2016).

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • solders 100%
  • eutectics 86%
  • Hastelloy (trademark) 32%
  • thermal shock 25%
  • temperature sensors 25%
• 2015

  A 600°C Wireless and Passive Temperature Sensor Based on Langasite SAW-Resonators

  Bruckner, G., Wall, B., Grünwald, R. & Klein, M., 2015, A 600°C Wireless and Passive Temperature Sensor Based on Langasite SAW-Resonators. Band Proceedings SENSOR 2015. S. 390 395 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel

  • Temperature sensors 100%
  • Resonators 87%
  • Temperature 37%
  • High temperature operations 26%
  • Metallizing 21%

• B5.4 - First Investigation of LTCC package for high temperature SAW sensors

  Bardong, J., Binder, A., Toskov, S., Miskovic, G. & Radosavljevic, G., 1 Jän. 2015, in: Proceedings SENSOR 2015.

  Publikation: Beitrag in Fachzeitschrift › Konferenzartikel › Begutachtung

  Open Access

  Datei

• Design, assembly and reliability of a hermetic package for a 600°C wireless temperature sensor

  Klein, M., Wall, B., International, V., Bruckner, G. & Ueki, K., 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC). S. 1351-1356 6 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel

  • temperature sensors 100%
  • assembly 76%
  • chips 70%
  • ceramics 29%
  • photolithography 24%

• Inspection of mechanical and electrical properties of silicon wafers using terahertz tomography and spectroscopy

  Arnold, T., Muehleisen, W., Schicker, J. & Hirschl, C., 2015, Proceedings of SPIE - The International Society for Optical Engineering.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

• Simulation of the deformation behaviour of large thin silicon wafers and comparison with experimental findings

  Schicker, J., Arnold, T., Hirschl, C., Iravani, A. & Kraft, M., 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
• 2014

  A new method for fast and accurate determination of the temperature coefficients of material constants up to 700°C. Application to LGS

  Nicolay, P., Bardong, J. & Bruckner, G., 2014, 2014 IEEE International Ultrasonics Symposium. S. 289-292 4 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • Temperature sensors 100%
  • Temperature 74%

• Thickness dependency of adhesion properties of TiW thin films

  Roshanghias, A., Pelzer, R., Khatibi, G. & Steinbrenner, J., 2014, Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
• 2013

  Design Study of a Wireless Pressure Sensor for Medical Application

  Bruckner, G., Schicker, J. & Schlumpf, P., 2013, Proceedings SENSOR 2013. Nürnberg, Band Proceedings SENSOR 2013. S. 192 197 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel

  • Medical applications 100%
  • Surface waves 98%
  • Pressure sensors 94%
  • Acoustic waves 70%
  • Membranes 49%
• 2012

  Nanoparticle enhanced solders for increased solder reliability

  Mokhtari, O., Roshanghias, A., Ashayer, R., Kotadia, H. R., Khomamizadeh, F., Kokabi, A. H., Clode, M. P., Miodownik, M. & Mannan, S. H., 2012, Materials Research Society Symposium Proceedings.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
• 2009

  Influence of packaging atmospheres on the durability of high-temperature SAW sensors

  Bardong, J., Bruckner, G., Kraft, M. & Fachberger, R., 2009, 2009 IEEE International Ultrasonics Symposium. S. 1680-1683 4 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel

• SAW strain sensitivity of selected rayleigh wave crystal cuts

  Bruckner, G., Stampf, G., Franz, G., Fachberger, R. & Hauser, R., 2009, 2009 IEEE International Ultrasonics Symposium. S. 823-826 4 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel
• 2008

  Durability of SAW transponders for wireless sensing in harsh environments

  Fachberger, R., Bruckner, G. & Binder, A., 2008, SENSORS, 2008 IEEE. S. 811-814 4 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel

  • Transponders 100%
  • Surface waves 91%
  • Durability 66%
  • Acoustic waves 64%
  • Acoustic surface wave devices 63%

• Precise measurements of BAW and SAW properties of Langasite in the temperature range from 25°C to 1000°C

  Bardong, J., Schulz, M., Schmitt, M., Shrena, I., Eisele, D., Mayer, E., Reindl, L. M. & Fritze, H., 2008, 2008 IEEE International Frequency Control Symposium. S. 326-331 6 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • acoustics 100%
  • tensors 86%
  • thermogravimetry 74%
  • surface acoustic wave devices 73%
  • oscillations 73%

• SAW ID tag for industrial application with large data capacity and anticollision capability

  Bruckner, G. & Fachberger, R., 2008, 2008 IEEE Ultrasonics Symposium. S. 300-303 4 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel

  • readout 100%
  • antennas 95%
  • acoustics 63%
  • performance 48%
  • temperature 32%
• 2007

  High temperature RFID system using passive SAW transponders

  Fachberger, R., Bruckner, G., Bardong, J. & Reindl, L., 2007, Proceedings of the European Microwave Association. Band 4. S. 194-200 6 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel

• 2006

  Wireless SAW based high-temperature measurement systems

  Fachberger, R., Bruckner, G., Hauser, R. & Reindl, L., 2006, 2006 IEEE International Frequency Control Symposium and Exposition. S. 358-367 10 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel

  • Surface waves 100%
  • Temperature measurement 95%
  • Acoustic waves 70%
  • Acoustic surface wave devices 46%
  • Phase matching 46%
• 2005

  Ceramic patch antenna for high temperature applications

  Hauser, R., Fachberger, R., Bruckner, G., Reicher, R. & Smetana, W., 2005, 28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005.. S. 173-178 6 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel

  • High temperature applications 100%
  • Microstrip antennas 75%
  • Temperature sensors 28%
  • Alumina 25%
  • Contamination 25%
• 2004

  A wireless SAW-based temperature sensor for harsh environment

  Hauser, R., Fachberger, R., Bruckner, G., Smetana, W., Reicher, R., Stelzer, A., Scheiblhofer, S. & Schuster, S., 2004, SENSORS, 2004 IEEE. S. 860-863 vol.2

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel

• Properties of radio frequency Rayleigh waves on langasite at elevated temperatures

  Fachberger, R., Bruckner, G., Hauser, R., Biniasch, J., Reindl, L. & Ruppel, C., 2004, IEEE Ultrasonics Symposium, 2004. Band 2. S. 1223-1226 Vol.2

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel

  • Rayleigh waves 100%
  • radio frequencies 71%
  • acoustics 48%
  • surface acoustic wave devices 35%
  • frequency response 26%