Ultra-Thin Chips (UTC) Integration on Inkjet-Printed Papers

Muhammad Hassan Malik, Lukas Rauter, Hubert Zangl, Alfred Binder, Ali Roshanghias

Publikation: Konferenzband/Beitrag in Buch/BerichtKonferenzartikelBegutachtung

Abstract

Paper as a substrate for electronic circuits with inkjet printing of conductors and insulators offers advantages such as low-cost, flexibility, eco-friendliness, and recyclability. To realize circuitry on papers, inkjet printing is one of the standard methodologies. However, heterogeneous integration of components on inkjet printed papers has faced reliability issues; therefore, inkjet printing is still not the mainstream in the fabrication of electronic papers (E-papers). Accordingly, in this study, the feasibility and reliability of integrating ultra-thin chips (UTC) on inkjet printed papers were discussed and analyzed. The significant effects of printed layer thickness on both electrical performance and long-term stability of the E-papers were demonstrated. The results were also compared to screen-printed papers.
OriginalspracheEnglisch
TitelUltra-Thin Chips (UTC) Integration on Inkjet-Printed Papers
Seiten1-4
DOIs
PublikationsstatusVeröffentlicht - 30 Juni 2022

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