Simulation of the deformation behaviour of large thin silicon wafers and comparison with experimental findings

J. Schicker; T. Arnold; C. Hirschl; A. Iravani; M. Kraft

doi:10.1109/EuroSimE.2015.7103141

Simulation of the deformation behaviour of large thin silicon wafers and comparison with experimental findings

J. Schicker, T. Arnold, C. Hirschl, A. Iravani, M. Kraft

Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

Originalsprache	Englisch
Titel	2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015
DOIs	https://doi.org/10.1109/EuroSimE.2015.7103141
Publikationsstatus	Veröffentlicht - 2015

Zugriff auf Dokument

10.1109/EuroSimE.2015.7103141

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http://www.scopus.com/inward/record.url?eid=2-s2.0-84944810606&partnerID=MN8TOARS

Dieses zitieren

Schicker, J., Arnold, T., Hirschl, C., Iravani, A., & Kraft, M. (2015). Simulation of the deformation behaviour of large thin silicon wafers and comparison with experimental findings. in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015 https://doi.org/10.1109/EuroSimE.2015.7103141

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title = "Simulation of the deformation behaviour of large thin silicon wafers and comparison with experimental findings",

author = "J. Schicker and T. Arnold and C. Hirschl and A. Iravani and M. Kraft",

year = "2015",

doi = "10.1109/EuroSimE.2015.7103141",

language = "English",

booktitle = "2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015",

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Schicker, J , Arnold, T , Hirschl, C, Iravani, A & Kraft, M 2015, Simulation of the deformation behaviour of large thin silicon wafers and comparison with experimental findings. in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. https://doi.org/10.1109/EuroSimE.2015.7103141

Simulation of the deformation behaviour of large thin silicon wafers and comparison with experimental findings. / Schicker, J.; Arnold, T.; Hirschl, C. et al.
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. 2015.

Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

TY - GEN

T1 - Simulation of the deformation behaviour of large thin silicon wafers and comparison with experimental findings

AU - Schicker, J.

AU - Arnold, T.

AU - Hirschl, C.

AU - Iravani, A.

AU - Kraft, M.

PY - 2015

Y1 - 2015

UR - http://www.scopus.com/inward/record.url?eid=2-s2.0-84944810606&partnerID=MN8TOARS

U2 - 10.1109/EuroSimE.2015.7103141

DO - 10.1109/EuroSimE.2015.7103141

M3 - Conference Paper

BT - 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015

ER -