Thickness dependency of adhesion properties of TiW thin films

A. Roshanghias, R. Pelzer, G. Khatibi, J. Steinbrenner

Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

Originalsprache	Englisch
Titel	Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014
DOIs	https://doi.org/10.1109/EPTC.2014.7028417
Publikationsstatus	Veröffentlicht - 2014

Zugriff auf Dokument

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title = "Thickness dependency of adhesion properties of TiW thin films",

author = "A. Roshanghias and R. Pelzer and G. Khatibi and J. Steinbrenner",

year = "2014",

doi = "10.1109/EPTC.2014.7028417",

language = "English",

booktitle = "Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014",

}

TY - GEN

T1 - Thickness dependency of adhesion properties of TiW thin films

AU - Roshanghias, A.

AU - Pelzer, R.

AU - Khatibi, G.

AU - Steinbrenner, J.

PY - 2014

Y1 - 2014

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U2 - 10.1109/EPTC.2014.7028417

DO - 10.1109/EPTC.2014.7028417

M3 - Conference Paper

BT - Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014

ER -