ASSIC Austrian Smart Systems Integration Research Center

Publikationen

Publikationen pro Jahr 2013 2017 2018 2020 2022 2023

• 51 Konferenzartikel
• 40 Artikel
• 15 Papier
• 4 Kapitel
• 7 Mehr
  • 4 Abstract
  • 2 Poster
  • 1 Patent

Publikationen pro Jahr

Publikationen pro Jahr

Suchergebnisse

• 2022

  Adhesion evaluation of parylene AF4 to silicon and glass substrate

  Sinani, T. & Miskovic, G., 4 Juli 2022, 2022 45th International Spring Seminar on Electronics Technology .

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • adhesion 100%
  • wafers 88%
  • evaluation 74%
  • glass 68%
  • silicon 63%

• Photoluminescence Imaging for Industrial Quality Control during Manufacturing of Thin-Film Solar Cells

  Zikulnig, J., Mühleisen, W., Simor, M., Gevaerts, V. & De Biasio, M., 8 Dez. 2022, IEEE Sensors Conference 2022. 2022 IEEE Sensors

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • solar cell 100%
  • gallium 98%
  • indium 96%
  • quality control 71%
  • manufacturing 62%

• Spectroscopic ellipsometry study of parylene AF4

  Solonenko, D., Petschnigg, M., Dao, T. D. & Miskovic, G., 4 Juli 2022, 2022 45th International Spring Seminar on Electronics Technology (ISSE).

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • ellipsometry 100%
  • refractivity 47%
  • optical transition 35%
  • ultraviolet radiation 33%
  • extinction 28%
• 2021

  Acoustic Particle Manipulation Along Three Orthogonal Directions in Laser Engraved Microfluidic Channels

  Fuchsluger, A., Hintermüller, M., Ecker, R., Cselyuszka, N., Moridi, M. & Jakoby, K., 17 Dez. 2021, IEEE Sensors 2021.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • acoustics 100%
  • laser 91%
  • particle 60%
  • separator 34%
  • vibration 28%
• 2020

  Analytical Scheme for the Calibration of Magnetic Position Systems

  Lumetti, S., Malago, P., Spitzer, D., Zaruba, S. & Ortner, M., 14 Nov. 2020, in: Engineering Proceedings.

  Publikation: Beitrag in Fachzeitschrift › Konferenzartikel › Begutachtung

  Open Access

  • Calibration 100%
  • Contamination 63%
  • Industrial applications 59%
  • Magnetic fields 57%
  • Costs 49%

• Harvester Circuit for Small Variable Temperature Gradients

  Lenzhofer, M., 5 März 2020, Conference Proceedings EASS 2020: Energieautonome Sensorsysteme. 10 Aufl. S. 31-33 3 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  Open Access

  • Harvesters 100%
  • Thermal gradients 87%
  • Networks (circuits) 47%
  • Microcontrollers 30%
  • Sensor nodes 14%

• Investigations of the magnetic circuit within a planar double core fluxgate sensor structure

  Lenzhofer, M., Roshanghias, A., Navaei, N. & Ortner, M., 2020, Sensoren und Messsysteme - Beitrage der 19. ITG/GMA-Fachtagung.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

• Stress analysis of Si chip sidewalls using micro-Raman spectroscopy

  Biasio, M. D., Ong, R., Seifert, C., Ossiander, I., Bernard, B., Roesner, M. & Kraft, M., 2020, Next-Generation Spectroscopic Technologies XIII. Profeta, L. T. M., Azad, A. K. & Barnett, S. M. (Hrsg.). Band 11390. S. 118 - 123

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • stress analysis 100%
  • Raman spectroscopy 70%
  • chips 65%
  • stress measurement 40%
  • silicon 17%

• Universal Energy Harvesting Topology Used for Small Variable Temperature Gradients

  Lenzhofer, M., 25 Juni 2020, SMSI 2020 - Sensors and Instrumentation. Band SMSI 2020 - Sensors and Instrumentation. S. 65-66 2 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  Open Access

  • Electron energy levels 100%
  • Thermal gradients 88%
  • Energy harvesting 88%
  • Topology 58%
  • Networks (circuits) 47%
• 2019

  High-Temperature Pressure Sensor Package and Characterization of Thermal Stress in the Assembly up to 500 °C

  Subbiah, N., Feng, Q., Wilde, J. & Bruckner, G., 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC). S. 878-883 6 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel
• 2018

  Analysis of Single - and Double Core Planar Fluxgate Sensors

  Navaei, N., Roshanghias, A., Lenzhofer, M. & Ortner, M., 2018, Eurosensors 2018.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

• Analytical Modelling of Magnetic Multimedia Control Elements Based on a Single Magnetic Sensor

  Ermakova, A., Martins, L., Spitzer, D. & Ortner, M., 2018, Eurosensors 2018.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

• Benefits and Application of Tree Structures in Gaussian Process Models to Optimize Magnetic Field Shaping Problems

  Vollert, N., Ortner, M. & Pilz, J., 2018, International Workshop on Simulation.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

• Demagnetization Analysis of Mechanical Manipulation on Permanent Magnets

  Ribeiro, M., Martins, L. & Ortner, M., 2018, International Conference on Computer Modeling and Simulation, UKSIM.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

• Flip-chip Die Attachment for High-temperature Pressure Sensor Packages up to 500 °C

  Subbiah, N., Feng, Q., Ramirez, K. A. B., Feil, N., Wilde, J. & Bruckner, G., 2018, 2018 7th Electronic System-Integration Technology Conference (ESTC). S. 1-6 6 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel

• Implementation of High-Temperature Pressure Sensor Package and Characterization up to 500°C

  Subbiah, N., Feng, Q., Frei, U., Wilde, J. & Bruckner, G., 2018, 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC). S. 355-358 4 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel

  • pressure sensors 100%
  • characterization 50%
  • sensors 41%
  • ultrasonic machining 40%
  • chips 36%

• Material constants extraction for AlScN thin films using a dual mode BAW resonator

  Parsapour, F., Pashchenko, V., Nicolay, P. & Muralt, P., 26 Apr. 2018, Material constants extraction for AlScN thin films using a dual mode baw resonator.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • resonators 100%
  • stiffness matrix 88%
  • acoustic velocity 69%
  • thin films 68%
  • shear 45%

• Modeling Planar Fluxgate Structures

  Ortner, M., Navaei, N. & Lenzhofer, M., 10 Dez. 2018, Eurosensors 2018.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • Magnetostatics 100%
  • Finite element method 43%

• Study of near-infrared imaging spectroscopy for the inspection of peeled potato tubers

  Arnold, T. & Debiasio, M., 2018, Proceedings of SPIE - The International Society for Optical Engineering.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

• Study of visible imaging and near-infrared imaging spectroscopy for plant root phenotyping

  Arnold, T. & Bodner, G., 2018, Proceedings of SPIE - The International Society for Optical Engineering.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

• Wireless, direct pressure sensing with saw devices at elevated temperatures

  Bruckner, G., Bardong, J., Szász, P. & Oschkera, S., 2018, 2018 IEEE International Ultrasonics Symposium (IUS). S. 1-9 9 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel
• 2017

  Analytical Development of a 4-Axis Magnetic Multimedia Control Element

  Ermakova, A., Spitzer, D. & Ortner, M., 2017, IEEE Sensors Conference.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

• Application of 3D-printed magnets for magnetic position detection systems

  Ortner, M., Huber, C., Vollert, N., Pilz, J. & Süss, D., 2017, IEEE Sensors Conference.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • Magnetization 100%
  • Magnets 86%
  • Magnetic fields 73%
  • 3D printers 41%
  • Permanent magnets 36%

• Application of NIR hyperspectral imaging for water distribution measurements in plant roots and soil

  Arnold, T., Leitner, R. & Bodner, G., 2017, Proceedings of IEEE Sensors.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

• Evaluation of an indirect slag level measurement for liquid steel

  Holzmann, D. & Arnold, T., 2017, Proceedings of IEEE Sensors.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • Level measurement 100%
  • Slags 72%
  • Liquids 49%
  • Steel 43%
  • Cooling water 32%

• Long Term Magnetic Sensor System Reliability Assessment

  Ribeiro, M., Ortner, M. & Spitzer, D., 2017, International Conference on Sensing Technology, ICST.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

• Magnetic field distortion from conductive layers for high frequency speed sensor applications

  Ortner, M. & Filipitsch, B., 2017, 2017 IEEE International Magnetics Conference (INTERMAG).

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • Magnetic fields 100%
  • Wheels 91%
  • Crucibles 76%
  • Magnetic sensors 74%
  • Eddy currents 59%

• Micro-Raman spectroscopy as a tool for the characterization of silicon carbide in power semiconductor material processing

  Biasio, M. D., Kraft, M., Schultz, M., Goller, B., Sternig, D., Esteve, R. & Roesner, M., 2017, Next-Generation Spectroscopic Technologies X. Druy, M. A., Crocombe, R. A., Barnett, S. M. & Profeta, L. T. (Hrsg.). Band 10210. S. 168 - 173

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

• Near infrared hyperspectral imaging system for root phenotyping

  Arnold, T., Leitner, R. & Bodner, G., 2017, Proceedings of SPIE - The International Society for Optical Engineering.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

• Non-contact measurement of silicon thin wafer warpage by THz tomography and laser triangulation

  Arnold, T., Schicker, J., Kraft, M. & Hirschl, C., 2017, Proceedings of IEEE Sensors.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

• Raman micro-spectroscopy as a non-destructive key analysis tool in current power semiconductor manufacturing

  Biasio, M. D., Kraft, M., Geier, E., Goller, B., Bergmann, C., Esteve, R., Cerezuela-Barreto, M., Lewke, D., Schellenberger, M. & Roesner, M., 2017, Next-Generation Spectroscopic Technologies X. Druy, M. A., Crocombe, R. A., Barnett, S. M. & Profeta, L. T. (Hrsg.). Band 10210. S. 133 - 140

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
• 2016

  Characterization of mid IR photonic MEMS

  Maier, F. J., Consani, C., Ranacher, C., Kenda, A., Gröschl, M. & Tortschanoff, A., 2016, Smart Systems Integration 2016 - International Conference and Exhibition on Integration Issues of Miniaturized Systems, SSI 2016.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

• Direct optical stress sensing in semiconductor manufacturing using Raman micro-spectrometry

  Biasio, M. D., Kraft, M., Roesner, M., Bergmann, C., Cerezuela-Barreto, M., Lewke, D. & Schellenberger, M., 3 Nov. 2016, 2016 IEEE SENSORS. IEEE Computer Society, S. 1-3 3 S. 7808575

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

• Ethylene gas sensing using non-dispersive infrared spectroscopy

  Biasio, M. D., Leitner, R., Krall, C., Krivec, M., Wilk, A., Mizaikoff, B., Waldner, R., Starmans, F. & Maier, D., 3 Nov. 2016, 2016 IEEE SENSORS. IEEE Computer Society, S. 1-3 3 S. 7808682

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

• Experimental investigations of the acousto-electric effect in high temperature SAW gas sensing

  Bruckner, G., Bardong, J., Postl, M. & Klug, A., 21 Sep. 2016, 2016 IEEE International Ultrasonics Symposium (IUS). S. 1-4 4 S. 7728736

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • high temperature gases 100%
  • sensors 53%
  • exhaust gases 38%
  • gases 14%

• LiNbO3 die-attach with Au-Ge eutectic solders

  Roshanghias, A., Bruckner, G. & Binder, A., 1 Nov. 2016, 2016 IEEE CPMT Symposium Japan, ICSJ 2016. S. 181-184 4 S. (2016 IEEE CPMT Symposium Japan, ICSJ 2016).

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • solders 100%
  • eutectics 86%
  • Hastelloy (trademark) 32%
  • thermal shock 25%
  • temperature sensors 25%

• Magnetic Field Focusing Design Guidelines for Long Range Position and Orientation Detection

  Ribeiro, M. & Ortner, M., 2016, International Journal of Simulation Systems, Science & Technology.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

• Spectroscopic Gas Sensing Using a Silicon Slab Waveguide

  Ranacher, C., Consani, C., Maier, F. J., Hedenig, U., Jannesari, R., Lavchiev, V., Tortschanoff, A., Grille, T. & Jakoby, B., 2016, Procedia Engineering.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

• Test Equipment for Analysis of Magnetic Position and Orientation Sensor Systems

  Ribeiro, M. & Ortner, M., 2016, International Conference on Electronic Design (ICED).

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

• 2015

  A 600°C Wireless and Passive Temperature Sensor Based on Langasite SAW-Resonators

  Bruckner, G., Wall, B., Grünwald, R. & Klein, M., 2015, A 600°C Wireless and Passive Temperature Sensor Based on Langasite SAW-Resonators. Band Proceedings SENSOR 2015. S. 390 395 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel

  • Temperature sensors 100%
  • Resonators 87%
  • Temperature 37%
  • High temperature operations 26%
  • Metallizing 21%

• Advanced 2.5D PCB Based MEMS Package

  Lenzhofer, M. & Tortschanoff, A., 2015, Smart Systems Integration 2015 - 9th International Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, NEMS, ICs and Electronic Components, SSI 2015.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

• An analytic approach to magnetic speed sensing

  Ortner, M. & Filipitsch, B., 2015, International Conference on Sensing Technology, ICST.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • Sensors 100%
  • Magnetic fields 85%
  • Bessel functions 69%
  • Eddy currents 50%
  • Skin 42%

• Design, assembly and reliability of a hermetic package for a 600°C wireless temperature sensor

  Klein, M., Wall, B., International, V., Bruckner, G. & Ueki, K., 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC). S. 1351-1356 6 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel

  • temperature sensors 100%
  • assembly 76%
  • chips 70%
  • ceramics 29%
  • photolithography 24%

• Determination of stress in silicon wafers using Raman spectroscopy

  Biasio, M. D., Neumaier, L., Vollert, N., Geier, E., Roesner, M., Hirschl, C. & Kraft, M., 2015, Next-Generation Spectroscopic Technologies VIII. Druy, M. A., Crocombe, R. A. & Bannon, D. P. (Hrsg.). Band 9482. S. 142 - 147

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

• Fluorescent marker-based and marker-free discrimination between healthy and cancerous human tissues using hyper-spectral imaging

  Arnold, T., De Biasio, M. & Leitner, R., 2015, Proceedings of SPIE - The International Society for Optical Engineering.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

• Functional MOEMS packaging with optical position feedback

  Tortschanoff, A., Baumgart, M. & Lenzhofer, M., 2015, 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

• Improving magnetic linear position measurement by field shaping

  Ortner, M., 2015, International Conference on Sensing Technology, ICST.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • Position measurement 100%
  • Magnets 81%
  • Magnetic field measurement 61%
  • Cost effectiveness 41%
  • Air 21%

• Integrated packaging of 2D MOEMS mirrors with optical position feedback

  Baumgart, M., Lenzhofer, M., Kremer, M. P. & Tortschanoff, A., 2015, Proceedings of SPIE - The International Society for Optical Engineering.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

• Magnetic field shaping for improved 1-D linear position measurement

  Ribeiro, M. & Ortner, M., 2015, International Conference on Sensing Technology, ICST.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

• Micro-Raman spectroscopy for meat type detection

  Biasio, M. D., Stampfer, P., Leitner, R., Huck, C. W., Wiedemair, V. & Balthasar, D., 2015, Next-Generation Spectroscopic Technologies VIII. Druy, M. A., Crocombe, R. A. & Bannon, D. P. (Hrsg.). Band 9482. S. 377 - 382

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung