Thin Wafer Pre-Align Gripping System – A new mechatronic approach to semiconductor handling

Alfred Binder, Georg Franz, Martin Lenzhofer, M. Soucek

Research output: Contribution to conference (No Proceedings) › Paper › peer-review

Original language	English
Publication status	Published - 2003
Event	10th annual IEEE Conference on Mechatronics and Machine Vision in Practice - Perth, Perth, Australia Duration: 1 Jan 1993 → …

Conference	10th annual IEEE Conference on Mechatronics and Machine Vision in Practice
Country/Territory	Australia
City	Perth
Period	1/01/93 → …

Cite this

@conference{46e0b768db894953a01783cc93a102a5,

title = "Thin Wafer Pre-Align Gripping System – A new mechatronic approach to semiconductor handling",

author = "Alfred Binder and Georg Franz and Martin Lenzhofer and M. Soucek",

year = "2003",

language = "English",

note = "10th annual IEEE Conference on Mechatronics and Machine Vision in Practice ; Conference date: 01-01-1993",

}

Thin Wafer Pre-Align Gripping System – A new mechatronic approach to semiconductor handling. / Binder, Alfred; Franz, Georg; Lenzhofer, Martin et al.
2003. Paper presented at 10th annual IEEE Conference on Mechatronics and Machine Vision in Practice, Perth, Western Australia, Australia.

Research output: Contribution to conference (No Proceedings) › Paper › peer-review