ASSIC - Project 2.1 Waferlevel Packages

Hirschl, Christina (PI)

2 Conference Paper
1 Paper
1 Article

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2023
Soft mask-based dry etching of parylene AF4 for advanced packaging applications
Bellaredj, M. L. F., Andrianov, N., Kaufhold, R. & Miskovic, G., 18 Jan 2023, p. 109. 113 p.
Research output: Contribution to conference (No Proceedings) › Paper › peer-review