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ASSIC - Project 2.1 Waferlevel Packages
Hirschl, Christina
(PI)
Executive Management
Sensor Systems
Overview
Fingerprint
Research output
(4)
Fingerprint
Explore the research topics touched on by this project. These labels are generated based on the underlying awards/grants. Together they form a unique fingerprint.
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Weight
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Physics & Astronomy
wafers
100%
gyroscopes
73%
packaging
69%
ellipsometry
65%
microelectromechanical systems
64%
masks
56%
adhesion
56%
silicon
50%
etching
50%
vapors
50%
glass
48%
evaluation
42%
nuclear magnetic resonance
39%
cells
35%
photoresists
35%
polymerization
31%
refractivity
30%
coatings
29%
gases
25%
vapor deposition
25%
costs
25%
optical transition
23%
ultraviolet radiation
22%
extinction
18%
argon
17%
oscillators
16%
atmospheres
15%
microscopy
15%
gas flow
15%
oscillations
14%
oxygen
13%
chambers
13%
chips
13%
curves
12%
coefficients
12%
molecules
11%
electronics
11%
wavelengths
10%
selectivity
10%
energy
6%
ions
5%