Publikationen pro Jahr
Publikationen pro Jahr
- 15 Ergebnisse
Suchergebnisse
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2023
Fully Printed GaTe Based Photodetector on PET Substrate
Odaci, C., Khan, M. S., Corzo, D., Jose, M., Roshanghias, A. & Aydemir, U., 2023, Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC), Munich, Germany, 2023. Munich, GermanyPublikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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GaSe-Based Fiber Optic Sensor for Human Health Monitoring
Odaci, C., Khan, M. S., Grüneberg, M., Beduk, T., Montagnese, M., Roshanghias, A. & Aydemir, U., 2023, 2023 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC). Munich, GermanyPublikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Integration of a High Temperature Transition Metal Oxide NTC Thin Film in a Microbolometer for LWIR Detection
Risquez, S., Redolfi, S., Fleury, C., Wulf, M., Roshanghias, A., Piot, A., Streque, J., Schmoltner, K., Dao, T. D., Puff, M. & Moridi, M., 2023, Integration of a High Temperature Transition Metal Oxide NTC Thin Film in a Microbolometer for LWIR Detection.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Magnetic field sensors for non-invasive current monitoring in wire-bond-less power modules
Malago, P., Lumetti, S., Holzmann, D., Ortner, M. & Roshanghias, A., 2023, Magnetic field sensors for non-invasive current monitoring in wire-bond-less power modules.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Non-destructive Na content analysis in bonded silicon-glass microcavities using laser-induced breakdown spectroscopy
Bereczki, T., Cselyuszka, N., 张俞骋, Guso, E., Fugger-Schafhauser, D. M., Menezes de Oliveira, B. N., Roshanghias, A. & Andrianov, N., 2023, Optical Waveguide and Laser Sensors II,.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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2022
High-Resolution Printing of Redistribution Layers for Fan-Out Wafer-Level Packaging by using Ultra-Precise Micro-deposition Technology
Roshanghias, A., Dreissigacker, M., Gradzka-Kurzaj, I., Binder, A., Ramelow, M. S., Witczak, Ł. & Braun, T., 16 Sep. 2022, 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). S. 254-258 5 S. 9939451Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Ultra-Thin Chips (UTC) Integration on Inkjet-Printed Papers
Malik, M. H., Rauter, L., Zangl, H., Binder, A. & Roshanghias, A., 30 Juni 2022, Ultra-Thin Chips (UTC) Integration on Inkjet-Printed Papers. S. 1-4Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
Open Access -
Utilizing Lateral Plate Transducer Modes for High Quality Acoustofluidics in Silicon-Based Chips
Fuchsluger, K., De Pastina, A., Nikolai, A., Roshanghias, A., Cselyuszka, N., Mitteramskogler, K., Ecker, K., Moridi, M. & Jakoby, B., 2022, IEEE Sensors. S. 1 4 S.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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2020
Investigations of the magnetic circuit within a planar double core fluxgate sensor structure
Lenzhofer, M., Roshanghias, A., Navaei, N. & Ortner, M., 2020, Sensoren und Messsysteme - Beitrage der 19. ITG/GMA-Fachtagung.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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2018
Analysis of Single - and Double Core Planar Fluxgate Sensors
Navaei, N., Roshanghias, A., Lenzhofer, M. & Ortner, M., 2018, Eurosensors 2018.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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2017
Digital micro-dispension of non-conductive adhesives (NCA) by inkjet printer
Roshanghias, A., Krivec, M. & Binder, A., 9 Dez. 2017, 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC). S. 1-3 3 S. 8277591Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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2016
LiNbO3 die-attach with Au-Ge eutectic solders
Roshanghias, A., Bruckner, G. & Binder, A., 1 Nov. 2016, 2016 IEEE CPMT Symposium Japan, ICSJ 2016. S. 181-184 4 S. (2016 IEEE CPMT Symposium Japan, ICSJ 2016).Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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Printed SAW transponder package for rapid prototyping of electronic packages
Roshanghias, A., Krivec, M., Bardong, J., Abram, A. & Binder, A., 15 Sep. 2016, 2016 6th Electronic System-Integration Technology Conference (ESTC). S. 1-4 4 S. 7764745Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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2014
Thickness dependency of adhesion properties of TiW thin films
Roshanghias, A., Pelzer, R., Khatibi, G. & Steinbrenner, J., 2014, Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
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2012
Nanoparticle enhanced solders for increased solder reliability
Mokhtari, O., Roshanghias, A., Ashayer, R., Kotadia, H. R., Khomamizadeh, F., Kokabi, A. H., Clode, M. P., Miodownik, M. & Mannan, S. H., 2012, Materials Research Society Symposium Proceedings.Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung