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Next-generation silicon-based power electronics for decarbonisation in mobility, industry and grid
Roshanghias, Ali
(PI)
Overview
Fingerprint
Research output
(3)
Research output
Research output per year
2021
2021
2022
2022
2
Article
1
Paper
Research output per year
Research output per year
2 results
Type
(ascending)
Publication Year, Title
Title
Type
(descending)
Filter
Article
Search results
Article
Evaluating Cu Printed Interconnects “Sinterconnects” versus Wire Bonds for Switching Converters
Hasan, M. N.
,
Polom, T.
,
Holzmann, D.
,
Malagó, P.
,
Binder, A.
&
Roshanghias, A.
,
25 Apr 2022
,
In:
Electronics.
Research output
:
Contribution to journal
›
Article
›
peer-review
Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging
Roshanghias, A.
,
Malago, P.
,
Kaczynski, J.
,
Polom, T.
,
Bardong, J.
,
Holzmann, D.
,
Malik, M-H.
,
Ortner, M.
,
Hirschl, C.
&
Binder, A.
,
13 Apr 2021
,
In:
Energies.
14
,
8
Research output
:
Contribution to journal
›
Article
›
peer-review
Open Access
Interconnect
100%
Packaging
95%
Copper
94%
Interconnection
50%
Module
45%