Next-generation silicon-based power electronics for decarbonisation in mobility, industry and grid

Roshanghias, Ali (PI)

2 Article
1 Paper

1 results

Filter

2021
Cu Pillar Planarization to Enhance Thermosonic Flipchip Bonding: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)
Roshanghias, A., Rodrigues, A., Kaczynski, J., Binder, A. & Schmidt, A., 1 Nov 2021, p. 1-3. 3 p.
Research output: Contribution to conference (No Proceedings) › Paper › peer-review