Research output per year
Research output per year
Search results
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2022
Evaluating Cu Printed Interconnects “Sinterconnects” versus Wire Bonds for Switching Converters
Hasan, M. N., Polom, T., Holzmann, D., Malagó, P., Binder, A. & Roshanghias, A., 25 Apr 2022, In: Electronics.Research output: Contribution to journal › Article › peer-review
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2021
Cu Pillar Planarization to Enhance Thermosonic Flipchip Bonding: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)
Roshanghias, A., Rodrigues, A., Kaczynski, J., Binder, A. & Schmidt, A., 1 Nov 2021, p. 1-3. 3 p.Research output: Contribution to conference (No Proceedings) › Paper › peer-review
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Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging
Roshanghias, A., Malago, P., Kaczynski, J., Polom, T., Bardong, J., Holzmann, D., Malik, M-H., Ortner, M., Hirschl, C. & Binder, A., 13 Apr 2021, In: Energies. 14, 8Research output: Contribution to journal › Article › peer-review
Open Access