Next-generation silicon-based power electronics for decarbonisation in mobility, industry and grid

Roshanghias, Ali (PI)

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2022

Evaluating Cu Printed Interconnects “Sinterconnects” versus Wire Bonds for Switching Converters
Hasan, M. N., Polom, T., Holzmann, D., Malagó, P., Binder, A. & Roshanghias, A., 25 Apr 2022, In: Electronics.
Research output: Contribution to journal › Article › peer-review
2021
Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging
Roshanghias, A., Malago, P., Kaczynski, J., Polom, T., Bardong, J., Holzmann, D., Malik, M-H., Ortner, M., Hirschl, C. & Binder, A., 13 Apr 2021, In: Energies. 14, 8
Research output: Contribution to journal › Article › peer-review

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