Best paper award

    Prize

    Description

    Best paper award 2018 entitled "Adhesive bonding methodologies for M(O)EMS packaging" corresponding author: Ali Roshanghias
    Degree of recognitionInternational

    Awarded at event

    Event title honor issuerInternational Microsystems, Packaging, Assembly and Circuits Technology
    LocationTaiwan, Taipei
    Period11 Oct 2018

      Fingerprint