Best paper award

    Prize

    Description

    Best paper award 2018 entitled "Adhesive bonding methodologies for M(O)EMS packaging" corresponding author: Ali Roshanghias
    Awarded date1 Dec 2018
    Degree of recognitionInternational

    Awarded at event

    Event title honor issuerInternational Microsystems, Packaging, Assembly and Circuits Technology
    LocationTaiwan, TaipeiShow on map
    Period11 Oct 2018

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