Flexible biomarker testing with wireless communication platform

2021
ACF bonding technology for paper- and PET-based disposable flexible hybrid electronics
Yoon, D-J., Malik, M-H., Yan, P., Paik, K-W. & Roshanghias, A., 2 Jän. 2021, in: Journal of Materials Science: Materials in Electronics. 32
Publikation: Beitrag in Fachzeitschrift › Artikel › Begutachtung
2020

Thermosonic fine-pitch flipchip bonding of silicon chips on screen printed paper and PET substrates
Roshanghias, A., Rodrigues, A. D. & Holzmann, D., Mai 2020, in: Microelectronic Engineering.
Publikation: Beitrag in Fachzeitschrift › Artikel › Begutachtung

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