ACF bonding technology for paper- and PET-based disposable flexible hybrid electronics

Dal-Jin Yoon, Muhammad-Hassan Malik, Pan Yan, Kyung-Wook Paik, Ali Roshanghias

    Publikation: Beitrag in FachzeitschriftArtikelBegutachtung


    In light of the necessity to introduce reliable interconnection technologies for the
    development of disposable diagnostic kits, fine-pitch flip-chip integration of
    bare silicon dies on the paper and polyethylene terephthalate (PET)-based
    substrates have gained increasing importance. As the key-enabler of a hybrid
    electronic system, the interconnection technology should provide reliable electrical and mechanical properties. Paper and PET are temperature- and pressuresensitive, and are not compatible with the conventional flip-chip bonding
    technologies, i.e., soldering and thermo-compression bonding. In this study, the
    feasibility of implementing Anisotropic Conductive Films (ACF) in hybrid
    integration was assessed, in which bare silicon dies with the thicknesses of
    30 lm and 730 lm were bonded to screen-printed paper and PET substrates. As
    an alternative to direct bare die bonding, the integration of PET- and paperbased interposers to printed substrates was also addressed here. Correspondingly, the long-term reliability of the ACF-bonded samples was assessed via
    dynamic bend cycling tests. It was shown that ACF provides robust and reliable
    interconnects on both substrates with a failure cycle of more than 45,000 cycles.
    FachzeitschriftJournal of Materials Science: Materials in Electronics
    PublikationsstatusVeröffentlicht - 2 Jän. 2021


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