Abstract
In light of the necessity to introduce reliable interconnection technologies for the
development of disposable diagnostic kits, fine-pitch flip-chip integration of
bare silicon dies on the paper and polyethylene terephthalate (PET)-based
substrates have gained increasing importance. As the key-enabler of a hybrid
electronic system, the interconnection technology should provide reliable electrical and mechanical properties. Paper and PET are temperature- and pressuresensitive, and are not compatible with the conventional flip-chip bonding
technologies, i.e., soldering and thermo-compression bonding. In this study, the
feasibility of implementing Anisotropic Conductive Films (ACF) in hybrid
integration was assessed, in which bare silicon dies with the thicknesses of
30 lm and 730 lm were bonded to screen-printed paper and PET substrates. As
an alternative to direct bare die bonding, the integration of PET- and paperbased interposers to printed substrates was also addressed here. Correspondingly, the long-term reliability of the ACF-bonded samples was assessed via
dynamic bend cycling tests. It was shown that ACF provides robust and reliable
interconnects on both substrates with a failure cycle of more than 45,000 cycles.
development of disposable diagnostic kits, fine-pitch flip-chip integration of
bare silicon dies on the paper and polyethylene terephthalate (PET)-based
substrates have gained increasing importance. As the key-enabler of a hybrid
electronic system, the interconnection technology should provide reliable electrical and mechanical properties. Paper and PET are temperature- and pressuresensitive, and are not compatible with the conventional flip-chip bonding
technologies, i.e., soldering and thermo-compression bonding. In this study, the
feasibility of implementing Anisotropic Conductive Films (ACF) in hybrid
integration was assessed, in which bare silicon dies with the thicknesses of
30 lm and 730 lm were bonded to screen-printed paper and PET substrates. As
an alternative to direct bare die bonding, the integration of PET- and paperbased interposers to printed substrates was also addressed here. Correspondingly, the long-term reliability of the ACF-bonded samples was assessed via
dynamic bend cycling tests. It was shown that ACF provides robust and reliable
interconnects on both substrates with a failure cycle of more than 45,000 cycles.
| Originalsprache | Englisch |
|---|---|
| Fachzeitschrift | Journal of Materials Science: Materials in Electronics |
| Jahrgang | 32 |
| DOIs | |
| Publikationsstatus | Veröffentlicht - 2 Jän. 2021 |