High-Resolution Printing of Redistribution Layers for Fan-Out Wafer-Level Packaging by using Ultra-Precise Micro-deposition Technology

Ali Roshanghias, Marc Dreissigacker, Iwona Gradzka-Kurzaj, Alfred Binder, Martin Schneider Ramelow, Łukasz Witczak, Tanja Braun

    Research output: Conference proceeding/Chapter in Book/Report/ › Conference Paper › peer-review

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    Engineering & Materials Science