Stress-free bonding technology with bondable thin glass layer for MEMS based pressure sensor

Xiaodong Hu, P. Mackowiak, Yucheng Zhang, Oswin Ehrmann, Klaus-Dieter Lang, Martin Schneider-Ramelow, Ulli Hansen, Simon Maus, Oliver Gyenge, Maozhou Meng, Ha-Duong Ngo

Research output: Conference proceeding/Chapter in Book/Report/Conference Paper

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Physics & Astronomy