Sn-Ag-Cu nanosolders: Melting behavior and phase diagram prediction in the Sn-rich corner of the ternary system

A. Roshanghias, J. Vrestal, A. Yakymovych, K.W. Richter, H. Ipser

Research output: Contribution to journal › Article › peer-review

Original language	English
Journal	Calphad: Computer Coupling of Phase Diagrams and Thermochemistry
DOIs	https://doi.org/10.1016/j.calphad.2015.04.003
Publication status	Published - 2015

Access to Document

TY - JOUR

T1 - Sn-Ag-Cu nanosolders: Melting behavior and phase diagram prediction in the Sn-rich corner of the ternary system

AU - Roshanghias, A.

AU - Vrestal, J.

AU - Yakymovych, A.

AU - Richter, K.W.

AU - Ipser, H.

PY - 2015

Y1 - 2015

UR - http://www.scopus.com/inward/record.url?eid=2-s2.0-84927583869&partnerID=MN8TOARS

U2 - 10.1016/j.calphad.2015.04.003

DO - 10.1016/j.calphad.2015.04.003

M3 - Article

JO - Calphad: Computer Coupling of Phase Diagrams and Thermochemistry

JF - Calphad: Computer Coupling of Phase Diagrams and Thermochemistry

ER -