Original language | English |
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Journal | Journal of Electronic Materials |
DOIs | |
Publication status | Published - 2012 |
Nanoindentation creep behavior of nanocomposite Sn-Ag-Cu solders
A. Roshanghias, A.H. Kokabi, Y. Miyashita, Y. Mutoh, I. Ihara, R.G. Guan Fatt, H.R. Madaah-Hosseini
Research output: Contribution to journal › Article › peer-review