Formation of intermetallic reaction layer and joining strength in nano-composite solder joint

A. Roshanghias, A.H. Kokabi, Y. Miyashita, Y. Mutoh, H.R. Madaah Hosseini

Research output: Contribution to journal › Article › peer-review

Original language	English
Journal	Journal of Materials Science: Materials in Electronics
DOIs	https://doi.org/10.1007/s10854-012-0829-z
Publication status	Published - 2013

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TY - JOUR

T1 - Formation of intermetallic reaction layer and joining strength in nano-composite solder joint

AU - Roshanghias, A.

AU - Kokabi, A.H.

AU - Miyashita, Y.

AU - Mutoh, Y.

AU - Madaah Hosseini, H.R.

PY - 2013

Y1 - 2013

UR - http://www.scopus.com/inward/record.url?eid=2-s2.0-84878589041&partnerID=MN8TOARS

U2 - 10.1007/s10854-012-0829-z

DO - 10.1007/s10854-012-0829-z

M3 - Article

JO - Journal of Materials Science: Materials in Electronics

JF - Journal of Materials Science: Materials in Electronics

ER -