Characterization of anodic bondable LTCC for wafer-level packaging

Xiaodong Hu; Manuel Bäuscher; Piotr Mackowiak; Yucheng Zhang; Ole Hoelck; Hans Walter; Martin Ihle; Steffen Ziesche; Ulli Hansen; Simon Maus; Oliver Gyenge; Biswajit Mukhopadhyay; Oswin Ehrmann; Klaus-Dieter Lang; Ha-Duong Ngo

doi:10.1109/EPTC.2016.7861529

Characterization of anodic bondable LTCC for wafer-level packaging

Xiaodong Hu, Manuel Bäuscher, Piotr Mackowiak, Yucheng Zhang, Ole Hoelck, Hans Walter, Martin Ihle, Steffen Ziesche, Ulli Hansen, Simon Maus, Oliver Gyenge, Biswajit Mukhopadhyay, Oswin Ehrmann, Klaus-Dieter Lang, Ha-Duong Ngo

Research output: Conference proceeding/Chapter in Book/Report/ › Conference Paper

Abstract

This work helps to clarify the effects on bondable Low Temperature Cofiered Cofired Ceramic(LTCC) material from Fraunhofer IKTS under different bonding conditions as changes in temperature, voltage and time. The Paper investigates silicon bonded to LTCC and silicon with a thin aluminum layer bonded to LTCC and compares both with anodic bonding of standard Borofloat 33^® from Schott GmbH to silicon. The result of this work provides a comprehensive overview of bonding parameters for the materials Borofloat 33^® and LTCC. An inspection of the bonding quality is carried out, which includes the optical inspection of the bonded area and interface observation via a scanning electron microscope (SEM). The bonding quality is also shown with the charge transfer during the bonding process. This paper can be used to achieve a higher degree of freedom in the design of hermetic wafer level packaging for various Micro-Electro-Mechanical System(MEMS) devices made of glass and ceramic materials.

Original language	English
Title of host publication	2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)
Pages	501-505
Number of pages	5
DOIs	https://doi.org/10.1109/EPTC.2016.7861529
Publication status	Published - 3 Dec 2016
Externally published	Yes
Event	2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore Duration: 30 Nov 2016 → 3 Dec 2016

Conference

Conference	2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)
Period	30/11/16 → 3/12/16

Keywords

Bonding
Silicon
Glass
Charge transfer
Aluminum
Temperature measurement

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10.1109/EPTC.2016.7861529

https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7861529

Cite this

Hu, X., Bäuscher, M., Mackowiak, P., Zhang, Y., Hoelck, O., Walter, H., Ihle, M., Ziesche, S., Hansen, U., Maus, S., Gyenge, O., Mukhopadhyay, B., Ehrmann, O., Lang, K.-D., & Ngo, H.-D. (2016). Characterization of anodic bondable LTCC for wafer-level packaging. In 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (pp. 501-505). Article 7861529 https://doi.org/10.1109/EPTC.2016.7861529

@inproceedings{4a7349f1deab4587a90c8c0b3032b497,

title = "Characterization of anodic bondable LTCC for wafer-level packaging",

abstract = "This work helps to clarify the effects on bondable Low Temperature Cofiered Cofired Ceramic(LTCC) material from Fraunhofer IKTS under different bonding conditions as changes in temperature, voltage and time. The Paper investigates silicon bonded to LTCC and silicon with a thin aluminum layer bonded to LTCC and compares both with anodic bonding of standard Borofloat 33{\textregistered} from Schott GmbH to silicon. The result of this work provides a comprehensive overview of bonding parameters for the materials Borofloat 33{\textregistered} and LTCC. An inspection of the bonding quality is carried out, which includes the optical inspection of the bonded area and interface observation via a scanning electron microscope (SEM). The bonding quality is also shown with the charge transfer during the bonding process. This paper can be used to achieve a higher degree of freedom in the design of hermetic wafer level packaging for various Micro-Electro-Mechanical System(MEMS) devices made of glass and ceramic materials.",

keywords = "Bonding, Silicon, Glass, Charge transfer, Aluminum, Temperature measurement",

author = "Xiaodong Hu and Manuel B{\"a}uscher and Piotr Mackowiak and Yucheng Zhang and Ole Hoelck and Hans Walter and Martin Ihle and Steffen Ziesche and Ulli Hansen and Simon Maus and Oliver Gyenge and Biswajit Mukhopadhyay and Oswin Ehrmann and Klaus-Dieter Lang and Ha-Duong Ngo",

year = "2016",

month = dec,

day = "3",

doi = "10.1109/EPTC.2016.7861529",

language = "English",

isbn = "978-1-5090-4370-5",

pages = "501--505",

booktitle = "2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)",

note = "2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) ; Conference date: 30-11-2016 Through 03-12-2016",

}

Hu, X, Bäuscher, M, Mackowiak, P, Zhang, Y, Hoelck, O, Walter, H, Ihle, M, Ziesche, S, Hansen, U, Maus, S, Gyenge, O, Mukhopadhyay, B, Ehrmann, O, Lang, K-D & Ngo, H-D 2016, Characterization of anodic bondable LTCC for wafer-level packaging. in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)., 7861529, pp. 501-505, 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 30/11/16. https://doi.org/10.1109/EPTC.2016.7861529

TY - GEN

T1 - Characterization of anodic bondable LTCC for wafer-level packaging

AU - Hu, Xiaodong

AU - Bäuscher, Manuel

AU - Mackowiak, Piotr

AU - Zhang, Yucheng

AU - Hoelck, Ole

AU - Walter, Hans

AU - Ihle, Martin

AU - Ziesche, Steffen

AU - Hansen, Ulli

AU - Maus, Simon

AU - Gyenge, Oliver

AU - Mukhopadhyay, Biswajit

AU - Ehrmann, Oswin

AU - Lang, Klaus-Dieter

AU - Ngo, Ha-Duong

PY - 2016/12/3

Y1 - 2016/12/3

N2 - This work helps to clarify the effects on bondable Low Temperature Cofiered Cofired Ceramic(LTCC) material from Fraunhofer IKTS under different bonding conditions as changes in temperature, voltage and time. The Paper investigates silicon bonded to LTCC and silicon with a thin aluminum layer bonded to LTCC and compares both with anodic bonding of standard Borofloat 33® from Schott GmbH to silicon. The result of this work provides a comprehensive overview of bonding parameters for the materials Borofloat 33® and LTCC. An inspection of the bonding quality is carried out, which includes the optical inspection of the bonded area and interface observation via a scanning electron microscope (SEM). The bonding quality is also shown with the charge transfer during the bonding process. This paper can be used to achieve a higher degree of freedom in the design of hermetic wafer level packaging for various Micro-Electro-Mechanical System(MEMS) devices made of glass and ceramic materials.

AB - This work helps to clarify the effects on bondable Low Temperature Cofiered Cofired Ceramic(LTCC) material from Fraunhofer IKTS under different bonding conditions as changes in temperature, voltage and time. The Paper investigates silicon bonded to LTCC and silicon with a thin aluminum layer bonded to LTCC and compares both with anodic bonding of standard Borofloat 33® from Schott GmbH to silicon. The result of this work provides a comprehensive overview of bonding parameters for the materials Borofloat 33® and LTCC. An inspection of the bonding quality is carried out, which includes the optical inspection of the bonded area and interface observation via a scanning electron microscope (SEM). The bonding quality is also shown with the charge transfer during the bonding process. This paper can be used to achieve a higher degree of freedom in the design of hermetic wafer level packaging for various Micro-Electro-Mechanical System(MEMS) devices made of glass and ceramic materials.

KW - Bonding

KW - Silicon

KW - Glass

KW - Charge transfer

KW - Aluminum

KW - Temperature measurement

UR - https://ieeexplore.ieee.org/document/7861529/

U2 - 10.1109/EPTC.2016.7861529

DO - 10.1109/EPTC.2016.7861529

M3 - Conference Paper

SN - 978-1-5090-4370-5

SP - 501

EP - 505

BT - 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)

T2 - 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)

Y2 - 30 November 2016 through 3 December 2016

ER -

Characterization of anodic bondable LTCC for wafer-level packaging

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Keywords

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