Characterization of anodic bondable LTCC for wafer-level packaging

Xiaodong Hu, Manuel Bäuscher, Piotr Mackowiak, Yucheng Zhang, Ole Hoelck, Hans Walter, Martin Ihle, Steffen Ziesche, Ulli Hansen, Simon Maus, Oliver Gyenge, Biswajit Mukhopadhyay, Oswin Ehrmann, Klaus-Dieter Lang, Ha-Duong Ngo

Research output: Conference proceeding/Chapter in Book/Report/ › Conference Paper

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Physics & Astronomy