Research output per year
Research output per year
Search results
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2022
Direct flip-chip bonding of bare dies to polypropylene-coated paper substrates without adhesives or solders
Rodrigues, A. D., Weissbach, T., Malik, M. H., Schmidt, W., Gumbiowski, R., Hübler, A., Binder, A. & Roshanghias, A., 26 Jul 2022, In: Journal of Materials Science: Materials in Electronics.Research output: Contribution to journal › Article › peer-review
Open Access -
Hybrid Integration of fine-pitch bare dies on polypropylene-coated paper substrates without using any adhesives or solders
Rodrigues, A. D., Weissbach, T., Malik, M. H., Schmidt, W., Gumbiowski, R., C. Hübler, A., Binder, A. & Roshanghias, A., 22 Mar 2022, p. 1. 1 p.Research output: Contribution to conference (No Proceedings) › Poster