Power Electronics Package Modelling for Advanced Thermal Simulations

Activity: Talk or presentation › Invited talk

Description

Thermal modelling and simulation of power electronic systems needs accurate component and package models. With the Tiny Power Box it was shown how detailed 3D package models of active and passive components can influence the thermal simulation results and are thereof key for high power density systems.
Period13 Mar 2024
Event titlePLECS Conference 2024: Thermal Modeling and Simulation
Event typeWorkshop
LocationZürich, SwitzerlandShow on map

Keywords

  • Thermal modelling
  • Thermal simulation
  • Power electronics packaging
  • High fidelity modelling

Documents & Links

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