Aktivität: Präsentation oder Vortrag › Geladener Gastvortrag
Beschreibung
Thermal modelling and simulation of power electronic systems needs accurate component and package models. With the Tiny Power Box it was shown how detailed 3D package models of active and passive components can influence the thermal simulation results and are thereof key for high power density systems.
Zeitraum
13 März 2024
Ereignistitel
PLECS Conference 2024: Thermal Modeling and Simulation