Simulation of the deformation behaviour of large thin silicon wafers and comparison with experimental findings

J. Schicker; T. Arnold; C. Hirschl; A. Iravani; M. Kraft

doi:10.1109/EuroSimE.2015.7103141

Simulation of the deformation behaviour of large thin silicon wafers and comparison with experimental findings

J. Schicker, T. Arnold, C. Hirschl, A. Iravani, M. Kraft

Research output: Conference proceeding/Chapter in Book/Report/ › Conference Paper › peer-review

Original language	English
Title of host publication	2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015
DOIs	https://doi.org/10.1109/EuroSimE.2015.7103141
Publication status	Published - 2015

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10.1109/EuroSimE.2015.7103141

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Schicker, J., Arnold, T., Hirschl, C., Iravani, A., & Kraft, M. (2015). Simulation of the deformation behaviour of large thin silicon wafers and comparison with experimental findings. In 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015 https://doi.org/10.1109/EuroSimE.2015.7103141

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title = "Simulation of the deformation behaviour of large thin silicon wafers and comparison with experimental findings",

author = "J. Schicker and T. Arnold and C. Hirschl and A. Iravani and M. Kraft",

year = "2015",

doi = "10.1109/EuroSimE.2015.7103141",

language = "English",

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Schicker, J , Arnold, T , Hirschl, C, Iravani, A & Kraft, M 2015, Simulation of the deformation behaviour of large thin silicon wafers and comparison with experimental findings. in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. https://doi.org/10.1109/EuroSimE.2015.7103141

Simulation of the deformation behaviour of large thin silicon wafers and comparison with experimental findings. / Schicker, J.; Arnold, T.; Hirschl, C. et al.
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. 2015.

Research output: Conference proceeding/Chapter in Book/Report/ › Conference Paper › peer-review

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T1 - Simulation of the deformation behaviour of large thin silicon wafers and comparison with experimental findings

AU - Schicker, J.

AU - Arnold, T.

AU - Hirschl, C.

AU - Iravani, A.

AU - Kraft, M.

PY - 2015

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U2 - 10.1109/EuroSimE.2015.7103141

DO - 10.1109/EuroSimE.2015.7103141

M3 - Conference Paper

BT - 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015

ER -

Simulation of the deformation behaviour of large thin silicon wafers and comparison with experimental findings

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