Simulation of the deformation behaviour of large thin silicon wafers and comparison with experimental findings

J. Schicker, T. Arnold, C. Hirschl, A. Iravani, M. Kraft

Research output: Conference proceeding/Chapter in Book/Report/Conference Paperpeer-review

Original languageEnglish
Title of host publication2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015
Publication statusPublished - 2015

Cite this