Original language | English |
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Journal | Journal of Electroceramics |
DOIs | |
Publication status | Published - 2017 |
Externally published | Yes |
Resistive random access memory (RRAM) technology: From material, device, selector, 3D integration to bottom-up fabrication
H.-Y. Chen, S. Brivio, C.-C. Chang, J. Frascaroli, T.-H. Hou, B. Hudec, M. Liu, H. Lv, G. Molas, J. Sohn, S. Spiga, V.M. Teja, E. Vianello, H.-S.P. Wong
Research output: Contribution to journal › Article › peer-review