Resistive random access memory (RRAM) technology: From material, device, selector, 3D integration to bottom-up fabrication

H.-Y. Chen; S. Brivio; C.-C. Chang; J. Frascaroli; T.-H. Hou; B. Hudec; M. Liu; H. Lv; G. Molas; J. Sohn; S. Spiga; V.M. Teja; E. Vianello; H.-S.P. Wong

doi:10.1007/s10832-017-0095-9

Resistive random access memory (RRAM) technology: From material, device, selector, 3D integration to bottom-up fabrication

H.-Y. Chen, S. Brivio, C.-C. Chang, J. Frascaroli, T.-H. Hou, B. Hudec, M. Liu, H. Lv, G. Molas, J. Sohn, S. Spiga, V.M. Teja, E. Vianello, H.-S.P. Wong

Publikation: Beitrag in Fachzeitschrift › Artikel › Begutachtung

Originalsprache	Englisch
Fachzeitschrift	Journal of Electroceramics
DOIs	https://doi.org/10.1007/s10832-017-0095-9
Publikationsstatus	Veröffentlicht - 2017
Extern publiziert	Ja

Zugriff auf Dokument

10.1007/s10832-017-0095-9

Andere Dateien und Links

http://www.scopus.com/inward/record.url?eid=2-s2.0-85021188975&partnerID=MN8TOARS

Dieses zitieren

Chen, H.-Y., Brivio, S., Chang, C.-C., Frascaroli, J., Hou, T.-H., Hudec, B., Liu, M., Lv, H., Molas, G., Sohn, J., Spiga, S., Teja, V. M., Vianello, E., & Wong, H.-SP. (2017). Resistive random access memory (RRAM) technology: From material, device, selector, 3D integration to bottom-up fabrication. Journal of Electroceramics. https://doi.org/10.1007/s10832-017-0095-9

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title = "Resistive random access memory (RRAM) technology: From material, device, selector, 3D integration to bottom-up fabrication",

author = "H.-Y. Chen and S. Brivio and C.-C. Chang and J. Frascaroli and T.-H. Hou and B. Hudec and M. Liu and H. Lv and G. Molas and J. Sohn and S. Spiga and V.M. Teja and E. Vianello and H.-S.P. Wong",

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doi = "10.1007/s10832-017-0095-9",

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TY - JOUR

T1 - Resistive random access memory (RRAM) technology: From material, device, selector, 3D integration to bottom-up fabrication

AU - Chen, H.-Y.

AU - Brivio, S.

AU - Chang, C.-C.

AU - Frascaroli, J.

AU - Hou, T.-H.

AU - Hudec, B.

AU - Liu, M.

AU - Lv, H.

AU - Molas, G.

AU - Sohn, J.

AU - Spiga, S.

AU - Teja, V.M.

AU - Vianello, E.

AU - Wong, H.-S.P.

PY - 2017

Y1 - 2017

UR - http://www.scopus.com/inward/record.url?eid=2-s2.0-85021188975&partnerID=MN8TOARS

U2 - 10.1007/s10832-017-0095-9

DO - 10.1007/s10832-017-0095-9

M3 - Article

SN - 1385-3449

JO - Journal of Electroceramics

JF - Journal of Electroceramics

ER -